Assembly structure of earphone holder and mobile terminal

A technology for assembling structure and mobile terminal, applied in the direction of telephone structure and other directions, can solve the problem of increasing the thickness of the whole machine, and achieve the effect of arrangement

Active Publication Date: 2018-09-11
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide an assembly structure of an earphone holder and a mobile terminal, aiming at solving the problem that in the prior art, when the space on the top side of the earphone holder of the mobile terminal is not enough for the layout of the earphone PCB board, it is easy to assemble the earphone holder structure. The problem that causes the thickness of the whole machine to increase

Method used

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  • Assembly structure of earphone holder and mobile terminal
  • Assembly structure of earphone holder and mobile terminal
  • Assembly structure of earphone holder and mobile terminal

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Embodiment Construction

[0019] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0020] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0021] In addition, it should be noted that the orientation terms such as left, right, up, and down in the embodiments of the present invention are only relative concepts or refer to the normal use state of the product, and...

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Abstract

The invention relates to the technical field of mobile terminals and discloses an earphone seat assembly structure and a mobile terminal. The earphone seat assembly structure comprises a FPC plate which is arranged inside a mobile terminal housing bottom side, a base support which is fixed inside the housing bottom side, an earphone seat and an earphone PCB which is electrically connected with the earphone seat. The earphone seat and the earphone PCB are fixed inside the base support; the earphone PCB and the FPC plate are electrically connected. The mobile terminal comprises a housing and an earphone seat assembly structure which is installed inside the housing. According to the above description, the earphone PCB and the earphone seat are fixed inside the housing bottom side through the seat support and are electrically connected with each other; the earphone seat and the FPC plate are electrically connected through the electrical connection between the earphone PCB and the FPC plate. Therefore, the earphone seat assembly structure can be configured inside the housing bottom side without increasing the thickness of the whole mobile terminal and under the circumstance that there is no space at the earphone seat top side for arranging a PCB.

Description

technical field [0001] The invention relates to the technical field of mobile terminals, in particular to an assembly structure of an earphone socket and a mobile terminal. Background technique [0002] At present, with the continuous improvement of the processing technology of mobile terminals, mobile terminals are basically developing towards the design direction of thinner and lighter overall structures. Therefore, the control of the thickness of the assembly structure becomes particularly critical. For the stacking assembly of the earphone socket structure of the mobile terminal, if the stacking assembly of the earphone socket structure is continued when the space on the top side of the earphone socket is not enough for the layout of the earphone PCB (Printed Circuit Board, printed circuit board), it will lead to The increase in the thickness of the assembly structure of the earphone holder leads to an increase in the overall thickness of the mobile terminal, which is no...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/04
CPCH04M1/04
Inventor 余卫斌成蛟
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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