Heat dissipation lamp
A technology for lamps and heat sinks, applied in lighting and heating equipment, cooling/heating devices for lighting devices, lighting devices, etc., can solve problems such as low heat conduction efficiency and slow heat dissipation speed
Active Publication Date: 2016-07-27
东莞市闻誉实业有限公司
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- Claims
- Application Information
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Problems solved by technology
The lighting device adopting the above-mentioned heat dissipation structure has low heat conduction efficiency and slow heat dissipation speed, which makes the lighting device prone to safety hazards of excessive heat load of internal circuit components due to poor heat dissipation
Method used
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[0027] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0028] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...
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The invention discloses a heat dissipation lamp. The heat dissipation lamp comprises a heat dissipation plate, a supporting frame, LED assemblies, an installation ball body and a circuit assembly. The supporting frame comprises a plurality of supporting twist sheets. The edge of the heat dissipation plate is connected with the middle of each supporting twist sheet. Each LED assembly comprises an installation tube body, a light rendering tube body and an LED module. The first end of each installation tube body is arranged on the heat dissipation plate, the second end of each installation tube body is connected with the first end of the corresponding light rendering tube body, each installation tube body is arranged in a hollow mode, and each LED module is arranged on the heat dissipation plate. The multiple installation tube bodies and the multiple light rendering tube bodies are arranged, and each installation tube body is connected with the corresponding light rendering tube body in a one-to-one correspondence mode. Each installation tube body is spliced with the corresponding light rendering tube body to form an arc-tube-shaped structure. The installation ball body is connected with the second end of each light rendering tube body. According to the heat dissipation lamp, the LED modules are directly installed on the heat dissipation plate, and the heat dissipation plate is arranged in an exposed mode, and heat can be quickly dissipated out in time and is not needed to be transmitted through a PCB aluminum substrate and a shell body.
Description
technical field [0001] The invention relates to the technical field of lighting and heat dissipation, in particular to a heat dissipation lamp. Background technique [0002] At present, in existing lighting devices, the main heating elements are usually the PCB aluminum substrate directly in contact with the light source, and the circuit board that drives the light source to emit light. In order to integrate the illuminating device, usually the PCB aluminum substrate and the circuit board are placed inside the illuminating device. [0003] Generally, PCB aluminum substrates and circuit boards generally transfer heat to the air through the housing. The illuminating device adopting the above heat dissipation structure has low heat conduction efficiency and slow heat dissipation speed, which makes the illuminating device prone to safety hazards of excessive heat load of internal circuit components due to poor heat dissipation. Contents of the invention [0004] Based on thi...
Claims
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Patent Timeline
Login to View More IPC IPC(8): F21K9/20F21V29/70F21V29/503F21V19/00F21Y115/10
CPCF21V19/001F21V29/503F21V29/70
Inventor 叶伟炳
Owner 东莞市闻誉实业有限公司