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Surrounding type illumination lamp

A lighting fixture, wrap-around technology, applied in lighting devices, lighting and heating equipment, cooling/heating devices of lighting devices, etc., can solve the problems of slow heat dissipation, low heat conduction efficiency, etc., and achieve the effect of rapid and timely radiation

Active Publication Date: 2016-07-27
东莞市闻誉实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The lighting device adopting the above-mentioned heat dissipation structure has low heat conduction efficiency and slow heat dissipation speed, which makes the lighting device prone to safety hazards of excessive heat load of internal circuit components due to poor heat dissipation

Method used

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  • Surrounding type illumination lamp
  • Surrounding type illumination lamp
  • Surrounding type illumination lamp

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Embodiment Construction

[0028] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0029] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...

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PUM

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Abstract

A surrounding type illumination lamp comprises a heat radiation plate, a supporting frame, an LED assembly, an installation spherical body and a circuit assembly. The supporting frame comprises a plurality of supporting torsion pieces. Each supporting torsion piece comprises a supporting part, a torsion part, an installation part and a light emitting part which are sequentially connected. The edge of the heat radiation plate is connected with the installation parts and connected with the middle of each supporting torsion piece. The LED assembly comprises an installation pipe body, a light rendering pipe body and an LED module, wherein a first end of the installation pipe body is arranged on the heat radiation plate, a second end of the installation pipe body is connected with a first end of the light rendering pipe body, the installation pipe body is hollow, and the LED module is arranged on the heat radiation plate and contained inside the installation pipe body. The installation spherical body is connected with a second end of the light rendering pipe body. According to the surrounding type illumination lamp, the LED module is directly installed on the heat radiation plate which is exposed, so that heat can be dissipated rapidly in time without transmission with a PCB aluminum substrate and a shell body.

Description

technical field [0001] The invention relates to the technical field of lighting and heat dissipation, in particular to a surrounding lighting fixture. Background technique [0002] At present, in existing lighting devices, the main heating elements are usually the PCB aluminum substrate directly in contact with the light source, and the circuit board that drives the light source to emit light. In order to integrate the illuminating device, usually the PCB aluminum substrate and the circuit board are placed inside the illuminating device. [0003] Generally, PCB aluminum substrates and circuit boards generally transfer heat to the air through the housing. The illuminating device adopting the above heat dissipation structure has low heat conduction efficiency and slow heat dissipation speed, which makes the illuminating device prone to safety hazards of excessive heat load of internal circuit components due to poor heat dissipation. Contents of the invention [0004] Based...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21K9/20F21K9/60F21V29/70F21V29/503F21Y115/10
CPCF21V29/503F21V29/70
Inventor 叶伟炳
Owner 东莞市闻誉实业有限公司