Copper alloy material for wire

A copper alloy and wire technology, applied in conductive materials, conductive materials, metal/alloy conductors, etc., can solve problems such as the decline of folding resistance, and achieve the effect of reducing the diameter of the wire and improving the conductivity

Inactive Publication Date: 2016-12-14
吴雅萍
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From the perspective of saving energy, reduce the diameter of wire conductors to reduce weight and save materials. However, the current carrying capacity of wire conductors in the past is fixed, and reducing the diameter of wires also reduces the reduction in passing capacity.
And the reduction in the diameter of the wire conductor leads to a decrease in the folding resistance, so the existing wires can no longer meet these requirements

Method used

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  • Copper alloy material for wire
  • Copper alloy material for wire

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Embodiment Construction

[0012] The present invention will be described in detail below through specific examples.

[0013] In the present invention, each component is measured by weight percentage.

[0014] The addition of nickel and silicon is an element to improve the strength of the copper alloy. The strength of the copper alloy is improved by forming silicon-nickel precipitates in the copper alloy through nickel and silicon. The weight percentage content of nickel is 1.5-2.0%, and the weight percentage content of indium The silicon content is 0.3-0.5%, and the weight percentage of silicon is 0.4-0.6%. Although these two elements can enhance the strength of copper alloys, the electrical conductivity of these two elements is much lower than that of copper. Too much addition will affect the electrical conductivity of copper alloys, increase the resistance of copper alloys, and reduce the conduction capacity. . The weight percentage of aluminum is 0.4-0.8%, which helps to improve the strength of th...

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Abstract

The invention relates to a copper alloy material for a wire. The copper alloy material comprises, by weight percent, 1.5% to 2.0% of nickel, 0.4% to 0.8% of aluminum, 0.3% to 0.5% of indium, 0.4% to 0.6% of silicon, 0.001% to 0.05% of lanthanum rare earth metal and the balance copper and inevitable impurities.

Description

technical field [0001] The invention belongs to the field of alloy materials, in particular to a copper alloy material for wires. Background technique [0002] The wires currently used, especially the wires and cables used in moving or vibrating places, mainly use annealed copper wires or twisted wires formed by twisting copper wires plated with tin, etc. as conductors. The conductors are covered with Wires with concentric insulators such as vinyl chloride or glued vinyl chloride. [0003] Recently, the requirements for the durability, folding resistance and electrical conductivity of wires have become higher and higher. From the perspective of saving energy, reduce the diameter of wire conductors to reduce weight and save materials, but the current carrying capacity of wire conductors in the past is fixed, and reducing the diameter of wires also reduces the reduction of passing capacity. Moreover, the reduction of the diameter of the wire conductor leads to a decrease in ...

Claims

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Application Information

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IPC IPC(8): C22C9/06H01B1/02
CPCC22C9/06H01B1/026
Inventor吴雅萍
Owner吴雅萍