Flexible organic electroluminescence display and electronic device

Abstract

The invention provides a flexible organic electroluminescence display and an electronic device. The flexible organic electroluminescence display comprises a flexible substrate, a packaging structure and an electroluminescence element, wherein the flexible substrate and the packaging structure are oppositely arranged; the electroluminescence element is located between the flexible substrate and the packaging structure; the packaging structure comprises at least one film packaging layer for covering the electroluminescence element; the film packaging layer is composed of a first inorganic layer and a second inorganic layer which are successively overlapped; the second inorganic layer is made from a nanometer crystal material. The second inorganic layer made from the nanometer crystal material is used for filling the holes, cracks and flaws possibly existing in the surface of the first inorganic layer, so that the defects of the first inorganic layer can be compensated, the performance of separating water and oxygen of the packaging structure can be promoted, the service life of the flexible organic electroluminescence display can be prolonged, and meanwhile, the thickness of the packaging structure can be reduced and the flexible organic electroluminescence display has better bending property.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a flexible organic electroluminescence display and electronic equipment. Background technique [0002] Flexible display devices have the advantages of rollability, impact resistance, strong shock resistance, small size, and easy portability. With the advancement of technology, flexible display devices have been more and more widely used, and are developing in the direction of thinner and lighter. The substrate used in the flexible display device must be a flexible substrate. When packaging, rigid substrates such as glass substrates cannot be used for packaging, and thin-film packaging technology is usually used for packaging. [0003] An existing thin-film packaging structure is a packaging structure formed by an inorganic layer film. The inorganic layer film usually has a good water and oxygen barrier performance, but the stress of the inorganic layer film is relatively large. ...

AI Technical Summary

Problems solved by technology

In order to effectively reduce the stress of the inorganic layer film, the thickness of the organic layer film is usually thicker. At the same time, in order to achieve a better effect of blocking water and oxygen, the stacked packaging structure usually includes a film structure of 5 to 7 layers, resulting in the entire packaging structure. The thickness of the package is generally 5-10 μm, and the package structure of this thickness will cause the flexible display device to fail to obtain a good flexible bending effect.

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