A metal mask manufacturing process and its manufacturing device

Abstract

The invention relates to the technical field of semiconductor manufacturing, in particular to a metal mask manufacturing process and a metal mask manufacturing device. The metal mask manufacturing process comprises the steps that a first substrate, a second substrate provided with a preset pattern, and a metal base material are provided; then, the surface, with the preset pattern, of the second substrate closely fits to the lower surface of the metal base material, and the smooth surface of the first substrate closely fits to the upper surface of the metal base material to form an integral structure; the integral structure is continuously heated and laminated to form an opening pattern on the metal base material; and after the metal base material with the opening pattern is cooled, the first substrate and the second substrate are removed to obtain a metal mask. The invention provides the brand new manufacturing process of the metal mask; a traditional manufacturing process uses acid liquid for etching, so that pollution are easy to generate in the manufacturing process; and the novel manufacturing process cannot generate pollution, and meanwhile, can manufacture the metal mask with ideal shape.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a metal mask manufacturing process and a manufacturing device thereof. Background technique [0002] In recent years, metal mask (Mask) is an indispensable intermediate product in the production of evaporated OLED, and its development is closely related to the development and promotion of OLED. [0003] At present, the manufacture of metal masks is produced by wet etching. The etching process mainly uses acidic solvents, which will pollute the environment if not handled properly. Due to the metal mask produced by wet etching, there is often an inconsistency between the width of the masking structure and the depth of the masking structure, and these two parameters are unfavorable factors for the evaporation of OLEDs. [0004] The greater the depth of the masking structure, the smaller the effective film width, and if the film width is not enough, the picture ...

AI Technical Summary

Problems solved by technology

The etching process mainly uses acidic solvents, which will pollute the environment if not handled properly

Due to the metal mask produced by wet etching, there is often an inconsistency between the width of the masking structure and the depth of the masking structure, and these two parameters are unfavorable factors for the evaporation of OLEDs.

[0004] The greater the depth of the masking structure, the smaller the effective film width, and if the film width is not enough, it will lead to lack of color in the picture (for example: the red picture is not red, sometimes it appears orange, etc.)

The smaller the width of the masking structure, the smaller the film width, and the reduction of the film width can reduce the risk of color mixing, that is, the reduction of the film width reduces the risk of color mixing while causing the lack of color in the picture. Therefore, the metal mask cannot reach the masking structure. The depth and the width of the shelter structure are optimally coordinated

[0005] Therefore, how to manufacture a metal mask in which the depth of the shielding structure and the width of the shielding structure cannot be optimally coordinated has become a major problem faced by those skilled in the art.

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