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packaging structure

A packaging structure and packaging material technology, applied in packaging, transportation and packaging, bottle/can parts, etc., can solve the problems of difficult module access, damage, damage to the bottom module, etc.

Active Publication Date: 2019-03-08
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of horizontal packaging is that the modules are stacked on top of each other, the weight is too heavy, and the bottom module is easily damaged due to vibration or impact during transportation
In addition, the disadvantage of the upright packaging is that it is not easy to take and place the module. At least two people are required to lift the module to a predetermined height on both sides of the module at the same time, and then put it into the box or take it out of the box. During the pick-and-place process, The module may be accidentally dropped or damaged, which may cause personal injury

Method used

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Embodiment Construction

[0049] The following embodiments are provided for detailed description. The embodiments are only used as examples for description, and are not intended to limit the scope of the present invention. In the following description, the same / similar symbols represent the same / similar elements.

[0050] Please refer to Figure 1A and Figure 1B The packaging structure 10 according to an embodiment of the present invention includes a packaging body 100 and a positioning structure 110. The packaging body 100 has an accommodating space S for accommodating a plurality of modules 11 placed upright, such as solar modules or other battery modules. The advantage of placing the modules upright is that the modules 11 are arranged in parallel, and the modules 11 will not be damaged due to vibration or impact during transportation due to stacking on each other. In addition, the positioning structure 110 is used to fix the module 11 in the packaging body 100 to prevent the module 11 from shaking. Fi...

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Abstract

The invention discloses a packaging structure which comprises a packaging body and a positioning structure. The packaging body is provided with an accommodating space, and the packaging body comprisesa plurality of packaging materials which are opposite to each other in the up-and-down direction, the front-back direction and the left-right direction, the left packaging material and the right packaging material are arranged on left and right sides of the packaging materials respectively, wherein the positioning structure comprises a sliding supporting structure which is arranged on at least one of the left packaging material and the right packaging material, when the left packaging material or the right packaging material with the sliding supporting structure is opened, a side opening is formed in the packaging body, and the sliding supporting structure extends out of the packaging body through the side opening of the packaging body, the sliding supporting structure can assist people in pushing the module into the packaging body or pulling out the module from the packaging body.

Description

Technical field [0001] The invention relates to a packaging structure, and in particular to a packaging structure in which modules are taken and placed through a lateral opening. Background technique [0002] Current packaging structures mostly use integrated packaging materials that are folded into a predetermined shape and then bound into a box. In order to place the module in the box or take out the module from the box, there are two types: horizontal packaging and vertical packaging. The disadvantage of the horizontal packaging is that the modules are stacked on each other, and the weight is too heavy and the bottom module is easily damaged due to vibration or impact during transportation. In addition, the disadvantage of the upright packaging is that the module is not easy to take and place. At least two people must lift the module to a predetermined height on both sides of the module at the same time, and then put it into the box or take it out of the box. The module may ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65D25/10B65D81/05B65D25/00B65D85/62B65D85/88B65D25/24B65D25/02
CPCB65D25/005B65D25/02B65D25/107B65D25/24B65D81/05B65D85/62B65D2585/88
Inventor 陈颢旻陈键煜张茂益杨峻鸣
Owner AU OPTRONICS CORP