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Electronic package and its manufacturing method

A technology for electronic packaging and electronic components, which is applied to electrical components, electrical solid devices, circuits, etc.

Active Publication Date: 2020-08-07
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to overcome the lack of known technology, the present invention provides an electronic package and its manufacturing method, so it can avoid the problems derived from the failure of electrical conduction of known electromagnetic shielding structures

Method used

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  • Electronic package and its manufacturing method
  • Electronic package and its manufacturing method
  • Electronic package and its manufacturing method

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Embodiment Construction

[0050] The implementation of the present invention is described below through specific specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0051] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for the understanding and reading of those familiar with this technology, and are not used to limit the implementation of the present invention Therefore, it has no technical substantive meaning. Any modification of structure, change of proportional relationship or adjustment of size shall still fall within the scope of this invention without affecting the effect and purpose of the present invention. The technical content disclosed by the invention must be within the scope covered. At the same time, terms such as "upper", "one" an...

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Abstract

An electronic package and its manufacturing method. In the manufacturing method, an electronic component and a retaining member are first arranged on a carrying structure, and then a cladding layer is formed on the carrying structure to cover each of the electronic components and the retaining member, and making the stopper exposed on the cladding layer, then removing the stopper to form a recess on the cladding layer, and finally forming a metal layer on the cladding layer and in the recess, utilizing the stopper that has been exposed on the cladding layer The cladding layer, therefore, only needs to remove the stopper, and the metal layer can be formed in the concave portion, so that the metal layer effectively forms an electromagnetic shielding compartment.

Description

technical field [0001] The invention relates to a packaging technology, in particular to an electronic package with electromagnetic shielding and its manufacturing method. Background technique [0002] With the evolution of semiconductor technology, semiconductor products have developed different packaging product types, and in order to improve electrical quality, many semiconductor products have a shielding function to prevent electromagnetic interference (Electromagnetic Interference, EMI). [0003] Figure 1A to Figure 1C It is a schematic cross-sectional view of the manufacturing method of the known semiconductor package 1 with shielding function. [0004] Such as Figure 1A As shown, a plurality of semiconductor elements 11 and metal plates 12 are placed on a carrier 10 , the semiconductor elements 11 are electrically connected to the carrier 10 , and the metal plate 12 is located between two adjacent semiconductor elements 11 . Next, an encapsulant 14 is formed on th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/552
CPCH01L23/552H01L2924/15311H01L2924/181H01L2924/19105H01L2924/3025H01L2224/16225H01L2224/48091H01L2224/48227H01L2924/00014H01L2924/00012
Inventor 赖昶存江政嘉王隆源王愉博
Owner SILICONWARE PRECISION IND CO LTD