Temperature-dependent solid material thermal diffusion coefficient measuring device and method

Abstract

The invention provides a temperature-dependent solid material thermal diffusion coefficient measuring device and method and belongs to the technical field of material thermophysical property testing.The temperature-dependent solid material thermal diffusion coefficient measuring device comprises a cylindrical testing material, an armored micro temperature measurement thermocouple, a temperature recorder, a thermostatic tube furnace, a cooling device and data analyzing software, wherein the armored micro temperature measurement thermocouple is arranged inside the cylindrical testing material,the cylindrical testing material is arranged inside the thermostatic tube furnace, the armored micro temperature measurement thermocouple is connected with the temperature recorder, the temperature recorder is connected with the data analyzing software, and the cooling device cools the cylindrical testing material. By measuring the temperature-to-time change laws of two different positions in theradius direction inside the cylindrical testing material and on the basis of analytic solution of transient heat conduction, the temperature-dependent solid material thermal diffusion coefficient measuring device and method can help acquire the nonlinear equation related to thermal diffusion coefficients and further acquire thermal diffusion coefficients. The temperature-dependent solid material thermal diffusion coefficient measuring method can achieve temperature-dependent continuous measurement of the thermal diffusion coefficients of solid materials.

Description

technical field [0001] The invention relates to the technical field of material thermophysical property testing, in particular to a measuring device and method for changing the thermal diffusivity of solid materials with temperature. Background technique [0002] In industrial applications, the thermal diffusivity of solid materials is a very important thermophysical parameter. The measurement of thermal diffusivity mostly uses transient methods, such as hot plate method, hot wire method, etc., but they are all measured at a fixed temperature. When the thermal diffusivity changes with temperature (the thermal diffusivity of most materials is change with temperature), it needs to be measured successively at different temperature levels, so the measurement workload is very large. [0003] According to the basic principle of solid heat conduction and the computer solution technology, the invention can measure the variation law of thermal diffusivity with temperature in an expe...

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Problems solved by technology

The measurement of thermal diffusivity mostly adopts transient methods, such as hot plate method, hot wire method, etc., but they are all measured at a certain fixed temperature. When the thermal diffusivity changes with temperature (the thermal diffusivity of most materials is changes with temperature), it needs to be measured successively at different temperature levels, so the measurement workload is very large

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