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Semiconductor device

A technology of semiconductors and semiconductor tubes, applied in the field of semiconductor devices with a redistribution layer structure, can solve the problem of a small number of I/O contacts, and achieve the effect of small volume

Inactive Publication Date: 2018-08-28
MEDIATEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, the PoP has a larger size due to the bulk of the molding compound, and the number of I / O contacts is also less

Method used

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  • Semiconductor device
  • Semiconductor device
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Embodiment Construction

[0027] DETAILED DESCRIPTION Specific terms are used to refer to specific elements. Those skilled in the art will understand that a manufacturer may use a different name for an element. In the present application, components are not distinguished by using different names for the components, but by different functions between the components. In the following detailed description and claims, the terms "comprising" and "comprising" are open definitions and should be understood as "including but not limited to". The term "coupled" should be understood as a direct or indirect electrical connection. Accordingly, if a device is electrically connected to another device, that connection may be a direct connection or an indirect connection through the use of other devices or connections.

[0028] Figure 1A is a schematic diagram of a semiconductor device 100 provided by an embodiment of the present invention. Figure 1B show Figure 1A A top view of the semiconductor device 100.

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Abstract

A semiconductor device includes a substrate, a body structure and an electronic component. The body structure is disposed above the substrate and includes a semiconductor die, a molding compound, a conductive component and a lower redistribution layer (RDL). The semiconductor die has an active surface. The molding compound encapsulates the semiconductor die and has a lower surface, an upper surface opposite to the lower surface and a through hole extending to the upper surface from the lower surface. The conductive component is formed within the through hole. The lower RDL is formed on the lower surface of the molding compound, the active surface of the semiconductor die and the conductive component exposed from the lower surface. The electronic component is disposed above the upper surface of the molding compound and electrically connected to the lower RDL through the conductive component. The semiconductor device has a small size.

Description

technical field [0001] The present invention relates to a semiconductor device, and in particular to a semiconductor device with a redistribution layer structure. Background technique [0002] In the electronics industry, high integration and multiple functions with high performance become essential for new products. And at the same time, since the production cost is directly proportional to its size, a high degree of integration causes high production cost. Therefore, the need for miniaturization of integrated circuit packaging becomes more and more important. [0003] Package-on-package (PoP) is now an effective solution for high-density system integration in a single chip, so package-on-package is now the fastest growing semiconductor packaging technology. In the PoP structure, various packages are integrated into a single semiconductor package to reduce the size of the semiconductor package. [0004] However, due to the bulk of the molding compound (molding compound),...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L25/18H01L23/31H01L23/538
CPCH01L23/5383H01L23/5384H01L25/16H01L25/18H01L23/3128H01L2924/15311H01L2224/12105H01L2224/16227H01L2224/16235H01L2224/32225H01L2224/73204H01L2224/16225H01L2924/00
Inventor 陈南诚周哲雅刘兴治郭哲宏
Owner MEDIATEK INC