A method for dissipating heat from a wire harness used in a single satellite unit

Abstract

The invention provides a method for dissipating heat from a wire harness for a single satellite unit. Firstly, a metal heat conduction groove is designed on the stand-alone frame, and then the heat conduction glue is weighed, and the components A and B are uniformly stirred according to the ratio of 1:1 and uniformly Coating on the inner wall of the heat conduction tank, laying wires, and carrying out corresponding binding and fixing; finally, silicone rubber is used to fix the wires. The invention realizes the effective heat dissipation of the bare wiring harness on the printed board in the single machine, reduces the risk of overheating damage to the wires and devices, improves the reliability of the device and the single machine, ensures the long life of the satellite, realizes effective and reliable splitting of the wiring harness, and optimizes the wiring of the wiring harness method, to achieve the goal of 15 or less wires in the construction requirements; to solve the problem of heat dissipation of bare wire bundles on the printed circuit board of the existing stand-alone machine, to lay a solid foundation for the reliability of the entire satellite and payload power supply, and to meet the long-life and high reliability of the satellite sexual demands.

Description

technical field [0001] The invention relates to the technical field of research and development of satellite power supply and distribution stand-alone products, in particular to a method for dissipating heat from a wire harness for a satellite stand-alone. Background technique [0002] At present, the newly developed satellites have high requirements for long life and high reliability. The power supply and distribution stand-alone machine needs to realize the function of supplying power to the satellite platform equipment and payload, and the printed circuit of the printed circuit board cannot effectively meet the requirements, so this type of stand-alone machine often adopts a wire design, and its large current requirements and the space limitation of the stand-alone machine , leading to the large diameter of the selected wire single wire, the diameter of multiple wires bundled is thick, the heat is concentrated, and it is not easy to dissipate heat. After long-term use, it...

AI Technical Summary

Problems solved by technology

[0003] At present, the domestic satellite stand-alone basically does not take special heat dissipation measures for the wire bundles on the printed board. Generally, the application of the wire bundles and the diameter of the bundles are generally taken as a general measure.