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Packaging method of oled display device and oled display device

A technology of a display device and an encapsulation method, applied in the field of OLED display devices, can solve the problems that it is difficult to meet the requirements of water and oxygen isolation, thermal conductivity and structural strength of the encapsulation structure at the same time.

Active Publication Date: 2020-07-07
TCL CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a packaging method for OLED display devices to solve the technical problem that the existing technology is difficult to meet the requirements of water and oxygen isolation, thermal conductivity and structural strength of the packaging structure at the same time

Method used

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  • Packaging method of oled display device and oled display device
  • Packaging method of oled display device and oled display device
  • Packaging method of oled display device and oled display device

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Embodiment Construction

[0043] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0044] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0045] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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Abstract

The invention relates to the field of display technology, and provides a packaging method of an OLED display device and an OLED display device. The packaging method includes: manufacturing an OLED panel on a substrate; sequentially preparing a first organic protective layer and a second inorganic protective layer on the OLED panel; Prepare a metal thin film on the side of the second inorganic protective layer, and the metal thin film is flush with the upper surface of the second inorganic protective layer; prepare the third organic protective layer on the second inorganic protective layer and the metal thin film; Protective layer, metal film and the side of the third organic protective layer are provided with glass glue, and the upper surface of the glass glue is flush with the third organic protective layer; Cover the cover plate above the third organic protective layer and the glass glue, harden the glass glue, and complete encapsulation. The OLED device is encapsulated by a multi-layer thin film combination combined with a metal thin film and glass glue, which increases the thermal conductivity, sealing performance and structural strength of the device. The method has simple process, is beneficial to cost control, and is applicable to industrial production.

Description

technical field [0001] The invention belongs to the field of display technology, and more specifically relates to a packaging method of an OLED display device and the OLED display device. Background technique [0002] Organic light-emitting diode (Organic Light-Emitting Diode, hereinafter referred to as: OLED) display device is known as an The third generation of fantasy display technology. At present, driven by the continuous capital investment and technology research and development of global manufacturers, OLED-based flat panel display technology is tending to the stage of increasingly mature mass production technology and rapid growth of market demand. [0003] For OLED display devices, the quality of encapsulation directly affects the structure and performance of the display. Possible problems in encapsulation include insufficient vacuum and poor sealing effect during the encapsulation process of the display after OLED production is completed, making moisture and oxyge...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56H01L51/52
CPCH10K50/8426H10K50/844H10K50/87H10K71/00
Inventor 谢铭曹蔚然
Owner TCL CORPORATION
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