Semiconductor structure and forming method thereof

A technology of semiconductor and gate structure, applied in the field of semiconductor structure and its formation, can solve the problems of addressable memory performance to be improved, achieve the effect of improving data storage capacity, improving electron loss problem, and improving performance

Active Publication Date: 2019-03-05
SEMICON MFG INT (SHANGHAI) CORP +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the performance of the prior art content addressable memory needs to be improved

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor structure and forming method thereof
  • Semiconductor structure and forming method thereof
  • Semiconductor structure and forming method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] It can be seen from the background art that the performance of content addressable memory (Content Addressable Memory, CAM) needs to be improved.

[0031] Specifically, after the content-addressable memory is subjected to the baking (Bake) treatment of the reliability test or after the long-term idle (Idle), the content-addressable memory is prone to data retention failure (Data Retention Fail) and threshold voltage shift ( Vt Shift) problem.

[0032] combined reference figure 1 and figure 2 , figure 1It is a relational graph of the threshold voltage of a content addressable storage unit corresponding to a content addressable memory and the number of samples of the content addressable storage unit; figure 2 yes figure 1 The graph showing the relationship between the threshold voltage of the content-addressable memory unit and the number of samples of the content-addressable memory unit after the content-addressable memory is baked. in, figure 1 and figure 2 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a semiconductor structure and a forming method thereof. The forming method comprises the following steps that a substrate is provided, wherein the substrate comprises a cell memory region and a content addressable memory region; a gate structure is formed on the substrate, wherein the gate structure comprises a tunneling oxide layer and a floating gate layer located on the tunneling oxide layer; a first source-drain doping region is formed in the substrate on the two sides of the gate structure of the cell memory region; and a second source-drain doping region is formedin the substrate on the two sides of the gate structure of the content addressable memory region, wherein the doping concentration of the second source-drain doping region is smaller than that of thefirst source-drain doping region. By reducing the doping concentration of the second source-drain doping region, the initial threshold voltage of the content addressable memory is increased, so that the number of electrons is increased when the floating gate layer is in an intrinsic state, and therefore, and the trap-assisted tunneling effect can be improved, thereby improving the data retention capacity of the content addressable memory; and in addition, the doping concentration of the first source-drain doping region is not affected, so that the performance of the cell memory region is not affected.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a semiconductor structure and a forming method thereof. Background technique [0002] At present, flash memory (Flash), also known as flash memory, has become the mainstream of non-volatile memory. According to different structures, flash memory can be divided into two types: Nor Flash and NAND Flash. The main feature of flash memory is that it can keep stored information for a long time without power on, and has the advantages of high integration, fast access speed, easy erasing and rewriting, etc., so it has been widely used in many fields such as microcomputer and automatic control a wide range of applications. [0003] Among them, NAND Flash includes not only cell (Cell) memory, but also content addressable memory (Content Addressable Memory, CAM). Content-addressable memory is a special type of memory that can search the entire memory in a single operation, so i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(China)
IPC IPC(8): H01L27/11524H10B41/35
CPCH10B41/35
Inventor张璐查源卿
OwnerSEMICON MFG INT (SHANGHAI) CORP