Multi-functional integrated conductive tape

Abstract

The invention discloses a multi-functional integrated conductive tape comprising a release film. A conductive shock absorption assembly and a conductive shielding assembly are arranged on a first sideof the release film side by side. The conductive shock absorption assembly comprises shock absorption foamed cotton and first conductive cloth covering the side face of the shock absorption foamed cotton. The end face, facing to the release film, of the conductive shock absorption assembly is coated with a conductive adhesive layer; the conductive shielding assembly comprises a shielding channel,and the end face, facing to the release film, of the conductive shielding assembly is partially or totally provided with a double-sided adhesive. The multi-functional integrated conductive tape is exquisite in design and simple in structure; two different assemblies integrate into a whole, so that when the multi-functional integrated conductive tape is used, and the two assemblies can be arrangedsimultaneously at one time; therefore, the assembly efficiency is effectively improved and the operation errors caused by step-by-step connection are effectively avoided; meanwhile, different assemblies have the functions of electric connection, electromagnetic shielding and shock absorption and dust prevention, and multi-functional integration is effectively achieved.

Description

technical field [0001] The invention relates to the field of electronic product materials, in particular to a multifunctional integrated conductive adhesive tape. Background technique [0002] With the rapid development of the electronics industry, the lightweight and thinning of electronic products such as notebooks, smart phones, and PADs has become a mainstream trend, which makes it imperative to reduce the weight and thickness of various components used in their production. [0003] The main boards of traditional electronic products mainly use materials such as copper foil and aluminum foil for attachment when realizing electrical connection and shielding. Lightweight and thinner requirements; and for different areas or components, different materials often need to be connected separately, which often requires step-by-step processing, which is low in operating efficiency and prone to accumulation of processing errors. Contents of the invention [0004] The object of t...

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Problems solved by technology

[0003] The main boards of traditional electronic products mainly use materials such as copper foil and aluminum foil for attachment when realizing electrical connection and shielding. However, these materials have disadvantages such as heavy weight, large attachment thickness, and low assembly yield, which cannot meet the requirements of the notebook and other electronic industries. Lightweight and thinner requirements; and for different areas or components, different materials often need to be connected separately, which often requires step-by-step processing, which is low in operating efficiency and prone to accumulation of processing errors

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