Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Disc cover rapid dismantling device used for wafer roasting unit

A technology for dismantling devices and disc covers, which is applied in the direction of workpiece clamping devices and manufacturing tools, which can solve problems such as burns and difficult disassembly of disc covers, and achieve the effects of convenient disassembly, uniform force, and guaranteed positioning accuracy

Active Publication Date: 2019-05-28
SHENYANG KINGSEMI CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The process of disassembling the disc cover at high temperature may cause a burn hazard, and at the same time, the disassembly of the disc cover was more difficult in the past

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Disc cover rapid dismantling device used for wafer roasting unit
  • Disc cover rapid dismantling device used for wafer roasting unit
  • Disc cover rapid dismantling device used for wafer roasting unit

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0024] Such as Figure 1-5 As shown, the present invention includes a disc cover body 1, an upper cover insulation fixing block 2, a locking fixing block 3, a magnet type locker 4, a locking pin 5, an upper cover removal block 8 and a disassembly assembly, wherein the disc cover body 1 It is a disc, and the outer edge is provided with an upper cover heat preservation fixed block 2, and there are two upper cover heat preservation fixed blocks 2 in this embodiment, which are symmetrically arranged on the left and right sides of the disk cover body 1; One end is fixed on the disc cover body 1, and the other end is connected with a locking pin 5.

[0025] There are locking and fixing blocks 3 installed on the wafer baking unit around the disc cover body 1 to support the disc cover body 1; the number of locking and fixing blocks 3 in this embodiment is the same a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the field of integrated circuit chip production, and particularly relates to a disc cover rapid dismantling device used for a wafer roasting unit. The device comprises a disccover body, an upper cover heat preserving fixing block, a locking fixing block, a magnetic type locking device, a locking pin, an upper cover dismantling block and a dismantling assembly, wherein thedisc cover body is provided with the upper cover heat preserving fixing block, one end of the upper cover heat preserving fixing block is installed on the disc cover body, and the locking pin is connected with the other end; the circumference of the disc cover body is provided with the locking fixing block which is installed on the wafer roasting unit, the magnetic type locking device is installed on the locking fixing block, one end of the locking pin is connected with the upper cover heat preserving fixing block, and the other end is inserted into the magnetic type locking device and fixedthrough magnetic force; the upper cover dismantling block is arranged on the disc cover body, and the dismantling assembly is inserted into the gap between the upper cover dismantling block and the disc cover body when the disc cover body needs to be dismantled. The disc cover rapid dismantling device has the advantages that the maintaining cleaning efficiency of the roasting unit can be effectively improved to provide help in improving the production capacity of semi-conductors and relieving the working intensity of maintaining workers to a larger extent.

Description

technical field [0001] The invention belongs to the field of integrated circuit chip manufacturing, in particular to a quick disassembly device for a disc cover used in a wafer baking unit. Background technique [0002] At present, in the semiconductor wafer processing process, the wafer baking unit needs to be frequently used. At different baking temperatures, a large amount of volatilized organic solvents will be generated inside the baking unit, and will be taken away by the exhaust system through the cover device, so the cleaning of the cover device is more frequent. The process of disassembling the disc cover at high temperature may cause burn hazards, and at the same time, the disassembly of the disc cover in the past is relatively difficult. Contents of the invention [0003] In order to solve the above-mentioned problems existing in the removal of the disk cover under the high temperature state, the object of the present invention is to provide a quick removal dev...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B25B11/00
Inventor 孙元斌
Owner SHENYANG KINGSEMI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com