Electronic package and method of manufacturing the same

A technology for electronic packaging and electronic components, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., and can solve problems such as insufficient support of copper pillars 14, poor electrical connection quality, and impact on product reliability. , to achieve the effect of improving the quality of electrical connection and product reliability, strengthening support, and avoiding delamination

Inactive Publication Date: 2019-05-28
SILICONWARE PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, during the grinding process of the aforementioned semiconductor package 1, due to the poor bonding force between the copper pillar 14 and the encapsulant 15, the support of the copper pillar 14 is not enough, and it is easy to cause the copper pillar 14 and the encapsulant 15 to be disconnected during grinding. The gaps between the encapsulants 15 cause delamination, so that the quality of the electrical connection is poor, thereby affecting the reliability of the product.

Method used

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  • Electronic package and method of manufacturing the same
  • Electronic package and method of manufacturing the same
  • Electronic package and method of manufacturing the same

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Embodiment Construction

[0076] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0077] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the same time, terms such as "above", "first", "second" and ...

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Abstract

The invention provides an electronic package and a method of manufacturing the same. The electronic package includes a first line structure, an electronic component coupled to the first line structure, a plurality of conductive pillars coupled to the first line structure, and a cladding layer covering the conductive pillars, wherein the conductive pillar includes a first pillar portion and a second pillar portion; and the width of the first pillar portion is different from the width of the second pillar portion, thereby increasing the bonding property between the conductive pillar and the cladding layer.

Description

technical field [0001] The invention relates to a semiconductor packaging technology, in particular to an electronic package with good reliability and a manufacturing method thereof. Background technique [0002] With the evolution of semiconductor packaging technology, semiconductor devices (Semiconductor device) have developed different packaging types, and in order to improve electrical functions and save packaging space, different three-dimensional packaging technologies have been developed, such as fan-out package stacking (Fan Out Package on package, referred to as FO PoP), etc., to cooperate with the greatly increased number of input / output ports on various chips, and then integrate integrated circuits with different functions into a single package structure. This packaging method can play a role in system packaging ( SiP) heterogeneous integration features, which can integrate electronic components with different functions, such as memory, central processing unit, gr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/498H01L21/48
CPCH01L2224/18
Inventor 张明滢孙崧桓傅凯伶沈绍平陈政佑
Owner SILICONWARE PRECISION IND CO LTD
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