Antenna packaging structure and method

Abstract

The invention provides an antenna packaging structure and method. The packaging structure comprises a re-wiring layer, a metal connecting column, a packaging layer, a first antenna metal layer, a transmission medium layer, a second antenna metal layer, an antenna circuit chip and a metal bump. The transmission medium layer is formed between the antenna metal layers, so that the loss among multiplelayers of antenna structures can be greatly reduced, and the power consumption of the packaging structure is reduced; the distance between the antenna metal layers can be reasonably set through the thickness of the transmission medium layer; a signal transmission line of elements in the packaging antenna structure is effectively shortened in a three-dimensional packaging mode, so that the electrical connection performance and efficiency of the packaging antenna are greatly improved; and the metal connecting column of the antenna can be formed in an electroplating or chemical plating mode, andthe large-diameter metal connecting column is obtained, so that the structural strength of the metal connecting column is improved, the process deviation is reduced, the feeder loss is reduced, the efficiency and performance of the antenna are improved, the loss of the multi-layer antenna structure can be reduced, and the manufacturing cost is reduced.

Description

technical field [0001] The invention belongs to the field of semiconductor packaging, in particular to an antenna packaging structure and packaging method. Background technique [0002] Due to the progress of science and technology, various high-tech electronic products have been developed to facilitate people's life, including various electronic devices, such as notebook computers, mobile phones, tablet computers (PADs), and the like. [0003] With the popularization of these high-tech electronic products and the increase of people's demand, in addition to the substantial increase of various functions and applications configured in these high-tech products, especially in order to meet people's mobile needs, the function of wireless communication has been added. Therefore, people can use these high-tech electronic products at any place or at any time through these high-tech electronic devices with wireless communication functions. Thereby greatly increasing the flexibility ...

AI Technical Summary

Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an antenna packaging structure and packaging method, which are used to solve the problems of low antenna efficiency and performance, long transmission signal lines, unreasonable layout and functional problems in the prior art. Consumption and other issues

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