Silicon wafer processing device and method

A technology for processing devices and silicon wafers, which is applied in the direction of photolithography exposure devices, microlithography exposure equipment, instruments, etc., and can solve the problems of expensive equipment and inability to achieve full-coverage exposure of silicon wafers

Active Publication Date: 2021-03-02
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a silicon wafer processing device and method to solve the problems that the existing equipment cannot realize the full coverage exposure of silicon wafers and the equipment is expensive, and at the same time realize the pre-alignment treatment of 8-inch or 12-inch silicon wafers

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  • Silicon wafer processing device and method
  • Silicon wafer processing device and method

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Embodiment Construction

[0049] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0050] As mentioned in the background art, the requirements for pre-alignment and edge exposure in the market are getting higher and higher, and the degree of automation is getting higher and higher. For the pre-alignment function, it is not only required to be able to complete the pre-alignment of various types of process wafers, but also to realize the processing of 8-inch and 12-inch silicon wafers at the same time. For the edge exposure function, it is not only required to realize edge exposure, multiple exp...

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Abstract

The present invention provides a silicon wafer processing device and method. The silicon wafer processing device includes: a silicon wafer carrying platform, used for absorbing and fixing the silicon wafer and moving or rotating the silicon wafer; The precise handover of the silicon wafer; the pre-alignment mirror group, which cooperates with the silicon wafer carrier to realize the centering and orientation of the silicon wafer; the edge exposure mirror group, which cooperates with the silicon wafer carrier to realize the exposure of different positions of the silicon wafer; the diaphragm and the light The aperture switching axis is used to adjust the size of the exposure field of view according to the edge exposure requirements; through the silicon wafer adsorption and handover mechanism, the precise handover of the silicon wafer during the centering and orientation process of the silicon wafer is realized, through the silicon wafer carrying platform, the edge The exposure lens group and the aperture switching axis realize the full-coverage exposure of the silicon wafer.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a silicon wafer processing device and method. Background technique [0002] Electroplating is one of the most important processes for the post-packaging of integrated circuits. Before the electroplating process, the photoresist on the edge of the silicon wafer needs to be removed. There are many traditional silicon wafer edge removal methods, but in general there are two categories: chemical edge removal method and edge exposure method. The edge exposure method is to vacuum absorb the silicon wafer on the rotating platform, fix a set of ultraviolet exposure lenses above the edge of the silicon wafer to produce a uniform illumination spot of a certain size, and then use the rotation of the rotating table to realize the edge exposure of the silicon wafer. Compared with the chemical edge removal method, the edge exposure method has the advantages of high production effici...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70716G03F7/70775
Inventor 王刚黄栋梁
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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