Two-phase immersion type liquid cooling device

Abstract

The invention discloses a two-phase immersion type liquid cooling device. The two-phase immersion type liquid cooling device comprises a refrigerating tank, a heating element and a condenser, whereinthe refrigerating tank is used for containing a refrigerant, the heating element is immersed in the refrigerant, and the condenser is fixedly arranged on the inner side of the refrigerating tank; a liquid phase area is arranged at the lower part of the refrigerating tank, a gas phase area is arranged at the upper part of the refrigerating tank, the gas phase area is in communication with an inletof the condenser, and an outlet of the condenser is in communication with the liquid phase area; and an outer cooling system is further arranged outside the condenser, the outer cooling system is further connected with a water supply pipeline and a water return pipeline, and heat exchange is carried out on the condenser through the water supply pipeline and the water return pipeline in the outer cooling system. According to the device, by means of the mode, the heating element is immersed in the refrigerant, a coolant phase change principle is utilized to realize the circulation cooling of theheating element, the capacity of a heat exchange system is high, and the temperature uniformity and the allowable maximum heat flux density of the heating element can be effectively improved.

Description

technical field [0001] The invention relates to a server cooling technology, in particular to a two-phase immersion liquid cooling device. Background technique [0002] With the rapid development of IT technology, the power density of servers has gradually increased, and heat dissipation has become an urgent problem to be solved in data centers. [0003] In traditional data centers, air cooling is used for heat dissipation, and fans are used to indirectly take away heat from servers. The ambient temperature of the computer room will gradually rise. By configuring the central air-conditioning cooling system in the computer room, the ambient temperature of the computer room is controlled at about 22°C. The air-cooled heat dissipation method has problems such as high noise, high power consumption, low cooling efficiency, and cooling limit. Contents of the invention [0004] The purpose of the present invention is to overcome the above-mentioned shortcomings of the prior art,...

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Problems solved by technology

[0003] In traditional data centers, air cooling is used for heat dissipation, and fans are used to indirectly take away heat from servers. The ambient temperature of the computer room will gradually rise. By configuring the central air-conditioning cooling system in the computer room, the ambient temperature of the computer room is controlled at about 22°C. The air-cooled heat dissipation method has problems such as high noise, high power consumption, low cooling efficiency, and cooling limit.

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