Package structure and method of forming the same

Abstract

A package structure that includes a first redistribution structure and a second redistribution structure is provided. The first redistribution structure includes a first dielectric layer, and a firstredistribution circuit in the first dielectric layer. The second redistribution structure includes a first portion on the first redistribution structure and a second portion on the first portion, andeach of the portions is electrically connected to the first redistribution structure and the first portion, respectively. The circuit density of the second portion is lower than that of the first portion. The first portion includes a second dielectric layer having a second redistribution circuit therein. The second portion includes a third dielectric layer having a third redistribution circuit therein. The third dielectric layer has a stiffener layer, which is separated from the third redistribution circuit by the third dielectric layer. A method of forming a package structure is also provided.

Description

technical field [0001] The invention relates to a packaging structure and a forming method thereof. Background technique [0002] With the vigorous development of the electronic industry, electronic products are also moving toward multi-functional and high-performance trends. At present, different packaging forms have been developed for the semiconductor packaging structure. In order to meet the packaging requirements of high integration and miniaturization of semiconductor packages, the packaging substrate has also evolved from a double-layer circuit board to a multi-layer circuit board to use layers in a limited space. Inter-connection technology expands the available wiring area on the packaging substrate, and can meet the needs of high circuit density integrated circuits, and reduce the thickness of the packaging substrate, so as to achieve the purpose of light and thin packaging structure and improve electrical functions. [0003] In the prior art, the conventional dri...

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Problems solved by technology

[0003] In the prior art, the conventional drilled sequential lamination method is used to laminate the separately completed rewiring structures. Since this method needs to combine the rewiring structures with each other through an interposer, the overall thickness cannot be reduced. and high manufacturing costs

Furthermore, in response to the trend of miniaturization and high density, a coreless packaging substrate has been developed. However, since the thickness of the coreless substrate becomes smaller, it cannot provide enough support to meet the requirements of planarization. , especially during high-temperature ball planting, the warping and deformation of the ultra-thin substrate is more serious due to heating, which has a negative impact on the subsequent packaging process

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