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Printed circuit board assemblies and terminals for handsets

A technology of printed circuit boards and components, which is applied in the direction of printed circuit components, printed circuits, printed circuits, etc., and can solve problems such as combustion, failure to meet explosion protection, layout and wiring without consideration of overvoltage or overcurrent, etc.

Active Publication Date: 2021-01-19
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be seen that the above-mentioned handset circuit has no overvoltage and overcurrent protection measures, and the layout and wiring on the PCB have not considered overvoltage or overcurrent. Therefore, it cannot meet the explosion-proof requirements.
Once there is overcurrent or overvoltage on the handset circuit, the smart phone is likely to be splashed, burned, exploded and other dangerous situations, especially dangerous in chemical factories, gas stations, gas, natural gas and other flammable and explosive places

Method used

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  • Printed circuit board assemblies and terminals for handsets
  • Printed circuit board assemblies and terminals for handsets
  • Printed circuit board assemblies and terminals for handsets

Examples

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Embodiment Construction

[0053] Specific embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0054] The present disclosure provides a printed circuit board assembly for an earpiece, such as figure 2 As shown, the printed circuit board assembly may include a printed circuit board body 1 and an earpiece device 2 disposed on the printed circuit board body 1 , wherein the earpiece device 2 has an explosion-proof protection mechanism.

[0055] In the present disclosure, the above-mentioned printed circuit board body 1 can be formed by laminating multiple layers, that is, the above-mentioned printed circuit board body 1 can be formed by laminating two or more layers of plates. For the printed circuit board body 1 The number of layers of the board layer c...

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PUM

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Abstract

The invention relates to a printed circuit board assembly applied to a handset and a terminal. The assembly comprises a printed circuit board body, and a handset device arranged on the printed circuitboard body. The line width of the wiring on the printed circuit board body meets a preset explosion-proof width condition, and the line spacing meets a preset explosion-proof spacing condition. The handset device includes a first voice input terminal and a second voice input terminal, which are connected with a handset control chip. The handset device further includes a resistor and a fuse, whichare connected in series. The first end of the resistor is connected with the first end of the fuse. The second end of the fuse is connected with the first voice input terminal. The package size of the resistor is 2512. The handset device further includes a handset, and the first end is connected with the second end of the resistor. The handset device further includes an electrostatic discharge protection device. The first end is connected with the second end of the resistor, and the second end is connected with the second end of the handset and the second voice input terminal. The explosion-proof performance of the terminal adopting the handset device can be improved, and safety and reliability can be ensured even in a place where high explosion-proof coefficients are required.

Description

technical field [0001] The present disclosure relates to the technical field of printed circuit boards, and in particular, relates to a printed circuit board assembly and a terminal for an earpiece. Background technique [0002] No matter how the smart phone is updated, it will be equipped with a handset, and a corresponding handset circuit will be designed for the handset. Most smartphones today use figure 1 handset circuit as shown in the figure 1 As shown, the two ports of the handset circuit respectively reserve two Electro-Static discharge (ESD) diodes, and the two channels are also connected in series with two 0-ohm resistors, and the rear of the two 0-ohm resistors Two capacitors are respectively connected in parallel at the terminals and then connected to the handset control chip (for example, CPU). Wherein, the antistatic capability of the smart phone can be improved by adjusting the resistance of the above two 0-ohm resistors, and the layout and routing of the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K1/18H04R3/00
CPCH04R3/00H05K1/0259H05K1/18H05K2201/10022H05K2201/10083H05K2201/10181
Inventor 王桂香
Owner BYD CO LTD
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