A processing device for LED encapsulation glue

Abstract

The invention discloses an LED encapsulation glue processing device, which comprises a box body. The inner cavity of the box body is respectively provided with a heating cavity, a mixing cavity, a filter pressure cavity and a degassing cavity, and the top of the box body is fixedly connected with an inlet A feed box, and a feed hopper is connected to the top of the feed box. The present invention relates to the technical field of LED encapsulation glue processing devices. In this LED encapsulation glue processing device, raw materials are added along the feeding hopper, and the raw materials enter the feeding box for grinding, and the first driving motor drives the grinding disc to rotate, and the raw material of the glue falls between the grinding disc and the grinding tank, and the grinding disc The rotation cooperates with the grinding tank to grind the material, which can quickly crush the remaining large particles in the glue, the grinding efficiency is high, and the gap between the grinding disc and the grinding tank is fixed, only the raw materials with small enough particles can fall, which can It is ensured that there are no large particles of solids in the raw material of the glue solution, so that the processed encapsulation glue is of better quality than the prior art.

Description

technical field [0001] The invention relates to the technical field of LED encapsulation glue processing devices, in particular to an LED encapsulation glue processing device. Background technique [0002] LED encapsulant: encapsulant for high-power light-emitting diodes, with high refractive index and high light transmittance, can increase the luminous flux of LED, low viscosity, easy to defoam, suitable for potting and molding, so that LED has better durability and reliability, the addition-type liquid silicone rubber potting compound has the advantages of colorless and transparent, no low molecular by-products, small stress, deep vulcanization, no corrosion, easy control of cross-linking structure, and small shrinkage of vulcanized products; It can be vulcanized at room temperature, and can also be vulcanized by heating; after curing, the colloid has excellent properties such as thermal shock resistance, high temperature aging resistance and ultraviolet radiation resistan...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a processing device for LED encapsulation glue, which solves the problem that there are large particles of solids inside the mixed glue solution, which will lead to insufficient mixing during mixing, and the encapsulation glue is often used in the production process. There will be lumps of condensation inside, and the quantity is too large, which not only affects the production speed of the encapsulant, but also makes the quality of the produced encapsulant poor.

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