Supercharge Your Innovation With Domain-Expert AI Agents!

A method for removing fpc covering film

A cover film and intermediate plate technology, applied in the secondary processing of printed circuits, printed circuit maintenance/correction, etc., can solve the problems of high equipment cost, inseparability, disappearance of line grinding, etc., and achieve simple operation, easy analysis, and low cost Effect

Active Publication Date: 2021-06-18
GUANGZHOU FASTPRINT CIRCUIT TECH +1
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the cover film is composed of PI and pure rubber, it is combined with the circuit after pressing and curing, and it is almost impossible to separate
[0004] When FPC has line quality defects such as open circuit short circuit, uneven etching, line sawtooth, etc., it is necessary to directly observe the condition of the line to determine the cause of failure in order to improve the production process. film, resulting in the inability to clearly observe the line
At present, for this problem, vertical slices, horizontal slices or X-Ray are mainly used to observe the failure location, but the vertical slice method can only see the cross section of the line but cannot see the surface of the line; due to the flexibility of the FPC, Grinding with horizontal slicing method can easily cause some circuits to be ground in place, while the other part of the circuit will be ground and disappeared; while the use of X-Ray method has high equipment costs, failure characteristics cannot be accurately determined, and defects cannot be accurately analyzed

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for removing fpc covering film
  • A method for removing fpc covering film
  • A method for removing fpc covering film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Embodiment 1 provides a kind of method for circuit board covering film, and this circuit board is FPC circuit board, comprises the steps:

[0042] see figure 1 , FPC is called a flexible circuit board, also known as a flexible circuit board. It is based on polyester film or polyimide (substrate 1), and the copper foil on the substrate 1 is etched to form a circuit (copper wire 3) 1. An extremely thin printed circuit board with high reliability and excellent flexibility, which is made by pressing and curing the cover film (including pure rubber 2 and outer cover film 4) onto the circuit.

[0043] S1: remove the outer insulating film of the FPC to obtain the first intermediate board;

[0044] see figure 2 , in step S1, the method for removing the outer insulating film is carried out according to the following steps: use an open flame to burn one corner of the FPC at a high temperature, and use a separation device to separate the outer insulating film at the corner from...

Embodiment 2

[0065] Embodiment 2 provides a kind of method for removing FPC covering film equally, and its step of removing FPC covering film is identical with embodiment 1, and difference is:

[0066] In step S2, the leavening treatment of the first intermediate plate is carried out according to the following steps: add leavening liquid medicine to the heating equipment, and heat the leavening liquid medicine to 72-88°C, put the first intermediate plate into the heating equipment Soak until the pure rubber on the surface of the FPC softens. In this step, the purpose of bulking treatment is to soften and expand the pure rubber on the surface of the FPC to facilitate subsequent friction treatment.

[0067] In a specific embodiment, the leavening syrup is prepared according to the following method: add 0.17-0.23L ether leavening agent to every liter of deionized water, stir well and add NaOH solution, the solubility of NaOH solution is 27-33g / L.

[0068] In step S4, plasma treatment refers...

Embodiment 3

[0076] Embodiment 3 provides a kind of method for removing FPC covering film equally, and its step of removing FPC covering film is identical with embodiment 1, and difference is:

[0077] In step S2, the leavening treatment of the first intermediate plate is specifically carried out according to the following steps: add leavening liquid medicine into the heating equipment, and heat the leavening liquid medicine to 72°C, put the first intermediate plate into the heating equipment to soak, Until the pure rubber 2 on the surface of the FPC is softened, in this step, the purpose of bulking treatment is to soften and expand the pure rubber 2 on the surface of the FPC to facilitate subsequent friction treatment.

[0078] In a specific embodiment, the leavening lotion is prepared according to the following method: add 0.17L ether leavening agent to every liter of deionized water, stir well and add NaOH solution, the solubility of NaOH solution is 27g / L.

[0079] In step S4, plasma t...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
concentrationaaaaaaaaaa
Login to View More

Abstract

The invention relates to a method for removing an FPC covering film, comprising: removing the outer insulating film of the FPC to obtain a first intermediate plate; bulking treatment, performing bulking treatment on the first intermediate plate to obtain a second intermediate plate; plasma processing, performing plasma treatment on the second intermediate plate to obtain a third intermediate plate; ultrasonic oscillation cleaning treatment, cleaning the third intermediate plate to obtain a finished product. The present invention can effectively remove the FPC outer insulating film and soft glue by removing the FPC outer insulating film, bulking treatment, plasma treatment, vibration cleaning, and performing two friction treatments, so that the inner copper wire can be clearly It is exposed, and there will be no situation where part of the circuit is ground in place and the other part of the circuit is ground and disappears in the horizontal slicing method. It is convenient to directly observe the condition of the circuit to determine the cause of failure when the quality of the FPC circuit is defective. The operation is simple and time-consuming Short and low cost, it is convenient for the analysis of FPC line defects.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method for removing an FPC cover film. Background technique [0002] At present, electronic products continue to develop in the direction of high density, miniaturization, and high reliability. Flexible printed circuit (FPC) is a kind of high reliability made of polyimide or polyester film as the base material. The excellent flexible printed circuit board has the characteristics of high wiring density, light weight, thin thickness and good bendability, so FPC has become a hot spot in the development of the current electronics industry. [0003] see figure 1 , FPC is an extremely thin printed circuit board made of polyester film or polyimide as the base material, forming lines on copper foil by etching, and pressing and curing the cover film to the lines. In flexible circuit boards, the cover film plays an important role in surface insulation, protecting circu...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/22
CPCH05K3/225
Inventor 黄振伦胡梦海
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com