Machining system and method for glass taper-free precision deep hole array

A processing system, no taper technology, applied in the direction of metal processing equipment, manufacturing tools, laser welding equipment, etc., can solve the problems of low efficiency of processing a single hole, damage to the surface of the hole processing edge, dust accumulation, etc., to avoid damage to the edge of the hole top , improve efficiency, reduce the effect of back damage

CN111098045AActive Publication Date: 2020-05-05WUHAN HGLASER ENG CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2020-05-05

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Abstract

The invention discloses a machining system for a glass taper-free precision deep hole array. The machining system sequentially comprises a laser, a beam expander, a dynamic beam shaping system, a galvanometer, a machining objective lens and a glass workpiece along a light path propagation path; the glass workpiece is mounted on a tooling fixture; the machining system also comprises an auxiliary system which is used for removing dust remained in holes in the laser drilling process; and a laser spot formed by the machining objective lens firstly acts on the lower surface of the glass workpiece,and the laser perforates the glass workpiece from bottom to top by adjusting the depth of the spot in the glass workpiece. The auxiliary system is positioned below the glass workpiece and removes dustgenerated in the laser drilling process below the glass workpiece, so that the problems of back surface damage and the like caused by the laser transmission effect of front surface machining are solved.
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Description

technical field

[0001] The invention belongs to the technical field of laser processing, and specifically relates to a processing system and method for glass non-taper precision deep hole arrays, which are suitable for transparent and brittle materials such as various glasses, and can be applied to 3C industries such as air-permeable array holes and heat dissipation array holes. The required precision deep hole array processing. Background technique

[0002] Glass has good light transmission performance and good chemical stability. Therefore, it is widely used in construction industry, daily use, art, medical treatment, chemistry, electronics, instrumentation, optical devices and so on.

[0003] However, since the tensile strength of glass is much lower than the compressive strength, it is a typical brittle material, so defects such as cracks are prone to occur during the processing of glass, which affects the strength of the product. The traditional laser micro deep hole ...

Examples

Embodiment Construction

[0049] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0050] like figure 1 As shown, this embodiment provides a processing system for a glass non-tapered precision deep hole array. Along the optical path propagation path, the processing system sequentially includes: a laser 1, a beam expander 2, a dynamic beam shaping system 3, The vibrating mirror 4, the processing objective lens 5, and the glass workpiece 7, the glass workpiece 7 is installed on the fixture 6; the processing system also includes an auxiliary system for removing the du...