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A fully automatic bonding machine

A bonding machine and fully automatic technology, applied in the direction of electrical components, electrical components, etc., can solve the problems that the production of electronic components cannot be automated

Active Publication Date: 2021-05-04
LONGNAN FANGCHENG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problem that the production of electronic components cannot be automated, and provides a fully automatic splicing machine

Method used

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  • A fully automatic bonding machine
  • A fully automatic bonding machine
  • A fully automatic bonding machine

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Embodiment Construction

[0028] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] It should be noted that the terms "comprising", "comprising" and "having" in the specification and claims of the present invention and the above drawings and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or...

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Abstract

The invention provides a fully automatic splicing machine, which is used in the technical field of automation equipment, including a suction device, a slide rail, a first drive device, a fixed table, a frame, a first distance sensor, a second distance sensor, a first feed device, second feeding device, third feeding device, shearing device, gluing device, material typesetting device, picking device, operating table and main control board, wherein the suction device includes a slider, a fixed plate and an induction slot, the first The first feeding device is provided with a feeding trough and the first runner, and the second feeding device is provided with a material trough and a splitter trough; through the fully automatic splicing machine of the present invention, it is possible to save the steps for workers to carry and connect electronic components, The whole joining process is convenient and automatic.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to a fully automatic bonding machine. Background technique [0002] For a long time, the mutual connection between electronic components has been realized step by step by different machines. After a machine completes an electronic component, it is necessary to manually glue, cut and typesetting the electronic components. , and finally transported to the next machine, such a process leads to a slow production progress, which is not conducive to the automatic production of electronic components; [0003] For this reason, it is necessary to propose a fully automatic bonding machine to solve the problem that the production of electronic components cannot be automated. Contents of the invention [0004] The invention aims to solve the problem that the production of electronic components cannot be automated, and provides a fully automatic splicing machine. [0005] The pr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/02H05K13/04H05K13/08
CPCH05K13/028H05K13/0409H05K13/0882
Inventor 孙虎
Owner LONGNAN FANGCHENG TECH CO LTD