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Full-automatic bonding machine

A bonding machine and fully automatic technology, applied in the direction of electrical components, electrical components, etc., can solve the problems that the production of electronic components cannot be automated

Active Publication Date: 2020-08-07
LONGNAN FANGCHENG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problem that the production of electronic components cannot be automated, and provides a fully automatic splicing machine

Method used

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  • Full-automatic bonding machine
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Embodiment Construction

[0028] It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0029] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0030] It should be noted that the terms "comprising", "comprising" and "having" in the specification and claims of the present invention and the above drawings and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or...

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Abstract

The invention provides a full-automatic bonding machine. The machine is applied to the technical field of automation equipment. The machine comprises a suction device, a sliding rail, a first drivingdevice, a fixing table, a rack, a first distance sensor, a second distance sensor, a first feeding device, a second feeding device, a third feeding device, a shearing device, a gluing device, a material typesetting device, a picking device, an operation table and a main control panel, wherein the suction device comprises a sliding block, a fixing plate and an induction groove, the first feeding device is provided with a feeding groove and a first rotating wheel, and the second feeding device is provided with a material groove and a flow dividing groove; by means of the full-automatic bonding machine, the step that workers carry electronic components needing to be bonded can be omitted, and the whole bonding process is convenient and automatic.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to a fully automatic bonding machine. Background technique [0002] For a long time, the mutual connection between electronic components has been realized step by step by different machines. After a machine completes an electronic component, it is necessary to manually glue, cut and typesetting the electronic components. , and finally transported to the next machine, such a process leads to a slow production progress, which is not conducive to the automatic production of electronic components; [0003] For this reason, it is necessary to propose a fully automatic bonding machine to solve the problem that the production of electronic components cannot be automated. Contents of the invention [0004] The invention aims to solve the problem that the production of electronic components cannot be automated, and provides a fully automatic splicing machine. [0005] The pr...

Claims

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Application Information

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IPC IPC(8): H05K13/02H05K13/04H05K13/08
CPCH05K13/028H05K13/0409H05K13/0882
Inventor 孙虎
Owner LONGNAN FANGCHENG TECH CO LTD