Ultrafast laser cutting method and device for transparent material

A transparent material and ultra-fast laser technology, which is applied in laser welding equipment, welding/welding/cutting items, manufacturing tools, etc., can solve problems such as limited processing, and achieve the effect of ensuring quality, good cutting effect, and ensuring reliability

Pending Publication Date: 2020-09-04
SUZHOU TUSEN LASER
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The purpose of the present invention is to provide an ultrafast laser cutting method for transparent materials, to overcome the problem of limited processing in the prior art, and to improve the precision and speed of laser transparent material processing

Method used

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  • Ultrafast laser cutting method and device for transparent material
  • Ultrafast laser cutting method and device for transparent material

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Embodiment 1

[0031] Embodiment one: see figure 2 As shown, an ultrafast laser cutting device for transparent materials includes an ultrafast pulse train laser, a light steering component, a Bessel cutting head, and a working platform. The transparent material to be processed is placed on the working platform.

[0032] Such as figure 1As shown, in the ultrafast pulse train laser, the ultrafast pulse train seed laser is composed of semiconductor lasers, multi-stage or single-stage fiber amplifiers, collimators, and triple frequency crystals are set. The semiconductor laser provides a wavelength between 1020 nm and 1090 nm. The pulse train seed laser in between is amplified by the fiber amplifier, enters the collimator, and then converted into ultraviolet light by the triple frequency crystal, and outputs the ultrafast pulse train laser. Wherein, each laser pulse train includes at least four laser pulses, the pulse width of each laser pulse is less than 60 ps, ​​the peak power of the pulse ...

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Abstract

The invention discloses an ultrafast laser cutting method and device for a transparent material. Pulse string seed lasers are provided through semiconductor laser modulation, third harmonic generationis carried out after the lasers are amplified through an optical fiber amplifier, and laser pulse strings are focused on a to-be-processed position of the transparent material through a Bethel cutting head. Three or more focusing points are formed in the processed material, and the transparent material is cut by moving the focusing positions. Each laser pulse string comprises at least four laserpulses, the pulse width is smaller than 60 ps, the peak power is larger than 1 MW, and the time between the adjacent laser pulses is shorter than 30 ns; the interval time between the adjacent pulse strings is longer than 100 ns; and the widening amount and compression amount of the laser pulse width both do not exceed 40% of the laser pulse width. According to the ultrafast laser cutting method and device, the reliability of light beam cutting is guaranteed, the waste heat of the former pulse is effectively utilized, the quality of cutting machining is guaranteed, and the linear and various special-shaped appearances of the material are cut.

Description

technical field [0001] The invention relates to a laser processing method, in particular to an ultrafast laser cutting method and a device thereof for cutting transparent materials. Background technique [0002] Glass and sapphire transparent materials have become an indispensable part of people's daily life. With the development of economy, the demand for glass products is increasing day by day. In the glass and sapphire production industry, glass and sapphire processing is a very important link. [0003] Generally speaking, glass and sapphire processing (cold processing) mainly includes polishing, cutting, drilling, engraving, edging, etc. In order to industrialize the above-mentioned glass and sapphire processing purposes, the processing methods used in the prior art mainly include mechanical processing methods, chemical processing methods (mainly used for polishing and etching), high-pressure water jet processing methods (mainly used for cutting and drilling) holes) an...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/402B23K26/0622B23K26/064
CPCB23K26/38B23K26/402B23K26/0622B23K26/064B23K2103/42B23K2103/54B23K2103/56
Inventor 蒋仕彬
Owner SUZHOU TUSEN LASER
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