A broadband heat-conducting wave-absorbing gasket and its preparation method

Abstract

The present invention relates to the technical field of preparation of heat-conducting and wave-absorbing materials, in particular to a broadband heat-conducting and wave-absorbing gasket and a preparation method thereof. The broadband heat-conducting and wave-absorbing gasket includes the following components in parts by mass: vinyl polysiloxane: 100-150 parts; Polydimethylsiloxane: 5-50 parts; Thermally conductive powder: 150-750 parts; Modified absorbing powder: 150-450 parts; Volatile solvent: 10-50 parts; Hydrogen 5-30 parts of silicone oil; 1-10 parts of inhibitor; 0.5-5 parts of catalyst. While improving the filling of the wave-absorbing filler and improving the wave-absorbing performance, the thermal conductivity of the material is greatly improved.

Description

technical field [0001] The invention relates to the technical field of preparation of heat-conducting wave-absorbing materials, in particular to a broadband heat-conducting wave-absorbing gasket and a preparation method thereof. Background technique [0002] Absorbing materials are widely used in electronic products. As the functions of electronic products become more and more powerful, and the volume becomes smaller and thinner, in addition to functional parts, there is more and more space for other auxiliary parts. The smaller it is, the more auxiliary functions need to be integrated as much as possible in a limited space. The thermal conductivity and electromagnetic wave absorbing functional fillers are integrated into one system, and the thermally conductive wave absorbing material comes into being. [0003] At present, thermally conductive and wave-absorbing materials are mainly used in the form of gaskets, which have both thermal conductivity and electromagnetic absor...

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Problems solved by technology

[0004] At present, there are still problems such as the difficulty of balancing heat conduction and wave absorption performance. If the filler is only filled with wave absorbing fillers, the general thermal conductivity k value is only 0.5~1W / m.k. The filler is matched with the filler. Too much heat-conducting filler has a certain attenuation effect on the absorbing performance, and leads to a weak absorption effect of the heat-conducting and absorbing material at low-frequency electromagnetic waves, especially below 3GHZ.

[0005] In the prior art, while improving the filling of the wave-absorbing filler and improving the wave-absorbing performance, the thermal conductivity of the material will be greatly reduced

In addition, excessive filling of thermally conductive fillers and wave-absorbing fillers will greatly affect the hardness and mechanical properties of the gasket

At present, for heat-conducting and wave-absorbing materials, under the filling of heat-conducting fillers and wave-absorbing fillers, the difference in compatibility between the two in the silicone system is often ignored, and it is difficult to have good and uniform dispersion of both, and the dispersion effect is not good. Well, the heat conduction and wave absorption properties are not ideal, and it is difficult to solve the problem of both heat conduction and wave absorption properties of heat conduction and wave absorbing materials

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