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Miniature microphone dustproof device and MEMS microphone

A dust-proof device and microphone technology, applied in the direction of sensors, electrostatic transducers, microphones, electrical components, etc., can solve the problems of poor dust-proof performance, irregular folds of dust-proof film, etc., and achieve the goal of improving the ability to resist external stress Effect

Active Publication Date: 2021-03-12
WEIFANG GOERTEK MICROELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the purpose of the present invention is to provide a micro-microphone dust-proof device and MEMS microphone, to solve the current dust-proof film prone to irregular folds due to external force, resulting in poor dust-proof performance and other problems

Method used

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  • Miniature microphone dustproof device and MEMS microphone
  • Miniature microphone dustproof device and MEMS microphone
  • Miniature microphone dustproof device and MEMS microphone

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Embodiment Construction

[0027] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of one or more embodiments. It may be evident, however, that these embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to facilitate describing one or more embodiments.

[0028] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying t...

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Abstract

The invention provides a miniature microphone dustproof device and an MEMS microphone. The miniature microphone dustproof device comprises a supporting carrier and a dustproof film arranged on the supporting carrier. The dustproof film comprises a fixed part fixed on the supporting carrier and a filter screen arranged in the center of the fixed part; the filter screen comprises at least two subarea areas, and each subarea area comprises a circumferential beam distributed in the preset circumferential direction of the corresponding subarea area and / or a radius beam distributed in the preset radius direction of the corresponding subarea area; the circumferential beams and / or the radius beams are used for adjusting the bending rigidity of the corresponding subarea areas and configuring the concave-convex shapes of the subarea areas. According to the invention, the bending rigidity of the dustproof film can be adjusted through the circumferential beams and / or the radius beams, so that thedustproof film can form any concave-convex shape, and the crease resistance is improved.

Description

technical field [0001] The invention relates to the technical field of electronic products, and more specifically, to a dust-proof device for a micro-microphone and a MEMS microphone provided with the dust-proof device for a micro-microphone. Background technique [0002] Existing MEMS microphones are usually equipped with a dust-proof structure, which mainly includes a support and a dust-proof film. The dust-proof structure prevents external dust, particles and other pollutants from entering the interior of the microphone, thereby ensuring the acoustic performance of the microphone product. [0003] However, due to the extremely thin thickness of the dust-proof film and the large ratio of its plane size to thickness, it is easy to deform and appear irregular folds when subjected to external forces such as thermal stress during processing or use; , In the process of dust-proof film processing, thermal stress is not easy to avoid, which makes the traditional dust-proof film p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003
Inventor 畠山庸平林育菁
Owner WEIFANG GOERTEK MICROELECTRONICS CO LTD