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Over molded gasket

A gasket and shielding cover technology, applied in the field of RF shielding cover, can solve the problem of large area of ​​printed circuit board

Inactive Publication Date: 2003-12-10
TELEFON AB LM ERICSSON (PUBL)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to make the bonding material have sufficient surface area, the bottom of the bonding material needs to occupy a large area of ​​the printed circuit board.

Method used

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  • Over molded gasket
  • Over molded gasket
  • Over molded gasket

Examples

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Embodiment Construction

[0012] Referring now to the accompanying drawings, and more specifically, to the figure 1 , the figure shows an embodiment of the gasket 5 prepared in the prior art along the side wall 10 of the shield. The process of preparing the gasket requires the gasket 5 to cover both sides of the side wall 10 in order to be well bonded. The width of the spacer 5 must also ensure that the covering part is adapted to variations in position of the side wall 10 .

[0013] see now figure 2 , the radio frequency shielding case 15 and the gasket mold 20 are shown in the figure. The RF shield 15 has a top surface 25 and sidewalls 30 extending downwardly from the top surface 25 . The downwardly extending sidewalls 30 form a plurality of alignment features 35 for proper alignment of the shield 15 with the spacer mold 20 . Although figure 2 The use of alignment elements 35 has been illustrated, but it should be understood that alignment elements are not necessary and that shield 15 can be p...

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PUM

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Abstract

An improved RF shielding device is disclosed. An RF shielding device includes a shield can having sidewalls defining a number of guide tabs thereon enabling the shield can to be inserted within a molding apparatus such that an electrically conductive gasket may be molded directly to the sidewalls of the shield can.

Description

technical field [0001] The invention relates to the application of radio frequency shielding, in particular to a radio frequency shielding case with re-injection gaskets. Background technique [0002] In electronic applications such as cellular telephones, RFI / EMI shielding is required to protect and shield sensitive components from interference from other components and external sources of interference. The main consideration when designing an RF shield is to minimize the area that the RF shield needs to occupy on the printed circuit board. This includes consideration of the base footprint of the RF shield, the seating accuracy of the RF shield and the allowable component spacing. [0003] The previous method of attaching RF shields was to solder metal shields directly to the printed circuit board. Soldering makes a good grounding between the shield and the printed circuit board, but the shield formed by this method is permanently fixed, and it is not easy to remove after...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00
CPCH05K9/0015H05K9/00
Inventor J·W·加蒙
Owner TELEFON AB LM ERICSSON (PUBL)