Flexible circuit board protective film coating device

Abstract

The invention relates to the technical field of flexible circuit boards, and discloses a flexible circuit board protective film coating device. The device comprises a shell, and the outer side of the shell is movably connected with a conveying belt; and the flexible circuit board is automatically clamped, the position of the flexible circuit board is adjusted, it is avoided that the flexible circuit board shifts under the vibration effect while being transferred along with the transmission belt, and it is guaranteed that the flexible circuit board can be effectively coated with a film. While the flexible circuit board is fixed, cleaning and film covering operations are triggered, linkage between structures is increased, operation is convenient and fast, and the automation degree is high; dust on the surface of the flexible circuit board is automatically cleaned and collected through the combined action of an air injection mechanism, a connecting pipe, a suction tool and a piston and the action of pressure intensity, so the adhesion between the circuit board and the protective film is prevented from being reduced due to the existence of dust, and the film covering effect is enhanced; and air is automatically sprayed to the protective film after cleaning is completed, and the protective film is bonded with the flexible circuit board, so film covering is achieved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a protective film coating device for flexible circuit boards. Background technique [0002] Flexible circuit boards are also known as flexible circuit boards and flexible circuit boards. They are favored for their light weight, thin thickness, and free bending and folding. During the processing of the flexible circuit board, it needs to be covered with a film to insulate the circuit from dust and moisture. At present, when laminating, the flexible circuit board is transferred to the lower part of the laminating mechanism by the conveying mechanism, and the protective film is attached to the flexible circuit board by using the flow of gas. However, in the actual operation process, the flexible circuit board is deflected by the vibration generated by the operation of the transmission mechanism, so that the circuit board cannot be completely covered by the protectiv...

AI Technical Summary

Problems solved by technology

However, in the actual operation process, the flexible circuit board is deflected by the vibration generated by the operation of the transmission mechanism, so that the circuit board cannot be completely covered by the protective film, reducing the coating effect

At the same time, the dust on the surface of the circuit board will affect the adhesion between the protective film and it, which is not conducive to the lamination operation, increases the scrap rate of production, and causes waste and unnecessary losses.

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