A welding device and method for leadless ceramic packaging components

Abstract

The invention relates to a welding device and method for leadless ceramic packaging components. In the device, a device placement area is set in the lower mold, and leadless ceramic packaging components are placed in the device placement area, and the upper surface of the device is not higher than the upper surface of the lower mold. , the lower surface is not lower than the lower surface of the lower mold; the frame formed by the surrounding frame covers the leadless ceramic package components, and the lower end of the surrounding frame is fixedly connected to the supporting sheet, and the supporting sheet covers the area formed by the surrounding frame, and the thickness of the supporting sheet is equal to the solder joint height, the support piece is fixed on the upper surface of the lower mold, and the support piece is provided with a number of through holes, and each through hole corresponds to the area other than the welding end of the bottom of the device. Print the padding material in each through hole during use, then remove the frame and support sheet, and form the support after the padding material is cured to complete the padding of the device; mount the padded device on the completed On the printed board of the solder paste printing process, the support member is in contact with the printed board for reflow soldering to complete the soldering of the device.

Description

technical field [0001] The invention belongs to the technical field of safety and reliability of electronic components, in particular to a welding device and method for leadless ceramic packaging components. Background technique [0002] Leadless ceramic package components are abbreviated as LCC devices. The side soldering end of the LCC device is connected to the bottom soldering end. The bottom soldering end and the corresponding pad on the printed board are soldered to form solder joints to complete the device function. However, after the welding is completed, due to changes in the ambient temperature during the use of the product, the thermal expansion coefficients of the ceramic body, solder joints, and printed board of the LCC device are inconsistent, and the solder joints undergo excessive creep due to shear stress, resulting in cracking and failure. Studies have shown that the larger the size of the ceramic body of the LCC device, the greater the shear stress on the ...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the problems existing in the prior art, the present invention provides a welding device and method for leadless ceramic packaging components, which solves the problem that the solder joint height cannot meet the standard requirements when using reflow soldering, and the traditional manual soldering has low efficiency and consistent solder joints. Solve the problem of poor performance, and solve the bottleneck problem of product reliability process on the basis of ensuring that the industry standard and welding quality consistency are met

Images