Modeling method for morphological characteristics of a terahertz device mounting material forming interface

A technology for material forming and shape characteristics, applied in 3D modeling, instruments, computer parts, etc., can solve problems such as modeling methods without terahertz technology

Active Publication Date: 2021-10-08
10TH RES INST OF CETC
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  • Abstract
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Problems solved by technology

Taking solder paste with several commonly used particle sizes (Sn63Pb37 solder paste) as an example, under the same soldering process or soldering temperature conditions, solder paste with the same composition forms different soldering interfaces due to different particle sizes. Under the effect of skin effect, different interfaces have different effects on the interconnection signal transmission performance of terahertz key devices after assembly. In addition, the design structural characteristics of terahertz devices will also limit the choice of micromachining technology. Therefore, how to adopt a suitable Regarding the modeling method of mounting materials for terahertz devices, there is currently no related technology or method research, and there is no related technology or method for modeling the surface morphology of mounting materials, and there is no construction suitable for terahertz technology. model method

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  • Modeling method for morphological characteristics of a terahertz device mounting material forming interface
  • Modeling method for morphological characteristics of a terahertz device mounting material forming interface
  • Modeling method for morphological characteristics of a terahertz device mounting material forming interface

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Embodiment Construction

[0015] refer to figure 1 . According to the present invention, the Monte Carlo sampling method is used to collect the same particle size mounting material molding interface sample specimen, with the help of three-dimensional laser scanning precision measurement technology, the fractal dimension calculation and determination of the sample specimen based on the power spectrum function method, according to the specimen The sample data of the shape height field in different dimensions and directions is obtained separately for the samples, and the discrete point cloud data of the surface topography of the molding surface of different dimensions of the mounting material is obtained. Perform feature extraction and identification to obtain effective discrete point cloud data; sample at equal intervals and fit correlation function curves of different dimensions, select appropriate correlation function model types of different dimensions according to the fitting correlation function cur...

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Abstract

The invention discloses a modeling method for morphological characteristics of a terahertz device mounting material forming interface, which comprises the following steps of: firstly, acquiring a mounting material forming interface sample test piece with the same particle size by adopting a Monte Carlo sampling method, and respectively acquiring morphological height field sample data in different dimension directions according to the test piece sample; performing feature extraction and recognition on measured point cloud data of the molding surface topography of the mounting material, selecting different-dimension correlation function model types according to a fitting correlation function curve, constructing correlation function models of height field point cloud data of the molding surface topography of the mounting material in different dimension directions, and forming correlation coefficient matrixes of different dimensions, using a matrix array product algorithm to realize a global correlation coefficient matrix; extracting various error components, and establishing a multi-scale surface height information and multi-scale surface topography information transmission model; and based on the fractal theory, establishing a model of the influence relationship between the mounting material granularity forming interface and the transmission performance of the interconnected signals after the assembly of the terahertz key device.

Description

technical field [0001] The invention relates to a modeling method for the morphology characteristics of the forming interface of a mounting material for a terahertz device. Background technique [0002] Terahertz (THZ) waves refer to electromagnetic waves between 0.1-10THz, which occupy a special position in the electromagnetic spectrum. They not only have some characteristics related to macroelectronics and microphotonics, but also exhibit low photon energy, Unique properties such as spectral multifunctionality and selective high transmittance. Terahertz waves have significant characteristic absorption for many materials, and the characteristic energy levels of a large part of biological tissues and organic macromolecules are in the terahertz wave frequency band, and no matter how small the difference in material structure and type will change the terahertz spectrum, making The terahertz spectrum of matter can distinguish the difference between very fine material structure...

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): G06T17/00G06T3/40G06K9/62G06F30/20G06F111/04G06F111/08G06F113/26
CPCG06T17/00G06T3/4007G06F30/20G06F2111/04G06F2111/08G06F2113/26G06F18/2321
Inventor海洋鲁聪申团辉
Owner10TH RES INST OF CETC