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Method for producing special solder ball through oil-gas mixed cooling

A technology of oil-gas mixing and solder balls, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as adding cooling pipes, affecting the roundness of solder balls, and running around solder balls, so as to increase the molding speed , improve product quality, and facilitate installation and placement

Pending Publication Date: 2022-02-18
郑州海普电子材料研究院有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Nowadays, there are two commonly used ball planting methods in the industry. One is to print solder paste on the BGA pads first, and then add solder balls of a certain size on it. At this time, the function of the solder paste is to stick the solder balls and When heating, the contact surface of the solder ball is made larger, so that the heating of the solder ball is faster and more comprehensive, which makes the solder ball better weldable to the BGA pad after melting and reduces the possibility of false soldering; It is to use solder paste instead of solder paste, but the solder paste will become liquid when the temperature rises, which will easily cause the sol

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  • Method for producing special solder ball through oil-gas mixed cooling

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Effect test

Embodiment 1

[0021] The invention discloses a method for producing special solder balls by mixing and cooling oil and gas. The production steps are as follows:

[0022] Step 1: Take a tin block with a purity higher than 97.0%, clean it, polish the surface, put it into a melting furnace, heat it to 350°C, and keep the temperature at 320°C;

[0023] Step 2: According to the diameter of the special solder ball, adjust the pipeline pressure to 0.15MPa through the central control equipment, and send the tin liquid from the hot melting furnace to the screening tube through the pipeline. The initial velocity of the tin liquid spray is 1.5m / s, a vibrator is installed on the outer wall of the screening tube, and the periodic vibration breaks the sprayed tin liquid into droplets, and the tin droplets are discharged from the discharge pipe and enter the cooling pipe;

[0024] Step 3: The cooling pipe is divided into two sections. The upper section passes high-purity nitrogen gas to cool the liquid d...

Embodiment 2

[0034] The invention discloses a method for producing special solder balls by mixing and cooling oil and gas. The production steps are as follows:

[0035] Step 1: Take a tin block with a purity higher than 97.0%, clean it, polish the surface, put it into a melting furnace, heat it to 380°C, and keep the temperature at 360°C;

[0036] Step 2: According to the diameter of the special solder ball, adjust the pipeline pressure to 0.2MPa through the central control equipment, and send the tin liquid from the hot melting furnace to the screening tube through the pipeline, and the initial velocity of the tin liquid spray is 3m / s , the outer wall of the screening tube is equipped with a vibrator, and the periodic vibration breaks the sprayed tin liquid into droplets, and the tin droplets are discharged from the discharge pipe and enter the cooling pipe;

[0037] Step 3: The cooling pipe is divided into two sections. The upper section passes high-purity nitrogen gas to cool the liquid...

Embodiment 3

[0047] The invention discloses a method for producing special solder balls by mixing and cooling oil and gas. The production steps are as follows:

[0048] Step 1: Take a tin block with a purity higher than 97.0%, clean it, polish the surface, put it into a melting furnace, heat it to 350°C, and keep the temperature at 330°C;

[0049] Step 2: According to the diameter of the special solder ball, adjust the pipeline pressure to 0.2MPa through the central control equipment, and send the tin liquid from the hot melting furnace to the screening tube through the pipeline, and the initial velocity of the tin liquid spray is 3m / s , the outer wall of the screening tube is equipped with a vibrator, and the periodic vibration breaks the sprayed tin liquid into droplets, and the tin droplets are discharged from the discharge pipe and enter the cooling pipe;

[0050] Step 3: The cooling pipe is divided into two sections. The upper section passes high-purity nitrogen gas to cool the liquid...

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Abstract

The invention discloses a method for producing a special solder ball through oil-gas mixed cooling. The method comprises the following steps of heating and melting a tin block, spraying out in a jet flow form, simultaneously dividing into multiple strands by a screen, breaking the jet flow by using high-frequency vibration, and then, carrying out oil-gas mixed cooling and solidification to obtain the solder ball. Compared with the prior art, the method has the beneficial effects that the tin liquid jet flow is vibrated and broken through the vibrator, the tin ball with the corresponding ball diameter is obtained by matching with the process, through oil-gas mixed cooling, the tin liquid is primarily cooled through nitrogen and primarily solidified and formed in the falling process, and then through oil-gas mixed cooling, cooling and solidification in the ball body are accelerated; and the height of the cooling pipe is reduced, the solder ball forming speed is increased, equipment installation and placement are facilitated, the solder ball roundness is increased, and the product quality is improved.

Description

technical field [0001] The invention relates to the technical field of BGA solder ball production, in particular to a method for producing special solder balls by mixing and cooling oil and gas. Background technique [0002] BGA ball planting is ball grid array packaging technology. The emergence of this technology has become the best choice for high-density, high-performance, multi-pin packaging such as CPUs, motherboard south bridge chips, and north bridge chips. However, the BGA package occupies a relatively large area of ​​the substrate. Although the technology has an increased I / O pin count, the distance between the pins is large, thereby improving assembly yield. Moreover, the technology adopts the controllable collapse chip welding method, which can improve its electrothermal performance. In addition, the assembly of this technology can be coplanar welding, which can greatly improve the reliability of the package; and the package CPU signal transmission delay reali...

Claims

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Application Information

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IPC IPC(8): H01L21/60
CPCH01L24/11H01L2224/11848
Inventor 唐坤王广欣马小庆王钰森崔文龙逯峙相楠
Owner 郑州海普电子材料研究院有限公司