Wave-absorbing heat-conducting gasket and preparation method thereof

Abstract

The invention discloses a heat-absorbing and heat-conducting gasket and a preparation method thereof, and the heat-absorbing and heat-conducting gasket is prepared by constructing a 3D heat-conducting channel in a liquid nitrogen directional freezing manner to prepare aerogel and then pouring liquid silicone rubber. The heat-conducting filler main body is h-BN with good heat-conducting property, the wave-absorbing filler main body is rGO, and the h-BN and the rGO are combined together through chemical bonds; h-BN and cane sugar have hydroxyl groups on the surface after ball milling, rGO has carboxyl groups on the surface after being treated by H2SO4, and the hydroxyl groups and the carboxyl groups are combined together through chemical bonds after reacting. The wave-absorbing and heat-conducting gasket shows excellent heat-conducting and wave-absorbing properties in the direction perpendicular to the gasket under the condition of extremely low filler filling amount (15wt%). Tests are carried out according to the ISO 22007-2 standard, the heat conductivity coefficient of the wave-absorbing heat-conducting gasket is larger than or equal to 2.0 W / m.K, the effective absorption bandwidth (RL is smaller than or equal to-10 dB) of the wave-absorbing heat-conducting gasket can reach 7.5 GHz when the thickness of the wave-absorbing heat-conducting gasket is 2 mm through testing of a vector network analyzer, and the wave-absorbing heat-conducting gasket shows excellent heat-conducting and wave-absorbing performance.

Description

technical field [0001] The invention relates to a wave-absorbing heat-conducting gasket and a preparation method thereof, belonging to the fields of thermal interface materials and electromagnetic wave absorption. Background technique [0002] With the increase in the power and integration of electronic equipment, the power density inside the system is also getting higher and higher, and a large amount of waste heat is generated during the operation of the equipment. At the same time, due to the narrow working environment of electronic equipment and poor air circulation, the waste heat cannot be transferred to the environment in time, which leads to the temperature rise of the device, and the working performance of the equipment is reduced or even burned. Therefore, in high-power chips, processors in a closed environment, etc., the heat dissipation of the device needs to be considered. Usually, thermal conductive silicone rubber is used to conduct excess heat to the external...

AI Technical Summary

Problems solved by technology

For wave absorption, 3D channels cannot be constructed. The construction of 3D channels makes it easy to produce "threshold residue" when the wave absorbers are connected together, so that the material does not have wave-absorbing properties.