Heat-conducting wave-absorbing gasket and preparation method thereof

The technology of gasket and wave absorbing filler is applied in the field of thermal conduction wave absorbing gasket and its preparation, which can solve the problem of low thermal conductivity and achieve the effects of suitable hardness, high thermal conductivity, resilience and compressibility

Pending Publication Date: 2022-03-25
东莞市博恩复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a heat-conducting wave-absorbing gasket and a preparation method thereof, aiming to solve the problem of low thermal conductivity of heat-conducting wave-absorbing gaskets in the prior art

Method used

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  • Heat-conducting wave-absorbing gasket and preparation method thereof
  • Heat-conducting wave-absorbing gasket and preparation method thereof
  • Heat-conducting wave-absorbing gasket and preparation method thereof

Examples

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Comparison scheme
Effect test

Embodiment 1

[0034] Preparation of the heat-conducting wave-absorbing gasket of embodiment 1:

[0035] 10% of silicone rubber with a viscosity of 200cs, 0.9% of hydrogen-containing silicone oil containing 0.18% of active hydrogen, 0.05% of inhibitors, and 0.05% of 2000ppm platinum catalyst were placed in a stirrer with a rotation speed of 25r / min and stirred for 10min to make Mix the liquid components evenly; then add 29% fibrous carbon fiber with a particle size of 200um, 60% spherical iron carbonyl with a particle size of 5um, control the stirrer speed at 60r / min, vacuum -0.09MPa, and continue stirring After 55min, the heat-conducting and wave-absorbing mixture was obtained after the components were mixed uniformly; finally, the heat-conducting and wave-absorbing mixture was transferred to the calender, and the rolling process was carried out through the calender rolls, and the magnetic field orientation was carried out by a curing conveyor furnace with a directional magnetic field (the l...

Embodiment 2

[0036] Preparation of the heat-conducting wave-absorbing gasket of embodiment 2:

[0037]11.9% of silicone rubber with a viscosity of 100cs, 1% of hydrogen-containing silicone oil containing 0.3% of active hydrogen, 0.01% of inhibitors, and 0.02% of 2000ppm platinum catalyst were placed in a stirrer with a rotation speed of 25r / min and stirred for 15min to make Mix the liquid components evenly; then add 17.07% fibrous carbon fiber with a particle size of 100um, 70% spherical carbonyl iron with a particle size of 30um, control the stirrer speed at 50r / min, vacuum -0.09Mpa, and continue stirring for 60min , so that the components are mixed evenly to obtain the heat-conducting and absorbing mixture; finally, the heat-conducting and absorbing mixture is transferred to the calender, and the calendering process is carried out through the calender rolls, and the magnetic field orientation is carried out by a curing conveyor furnace with an oriented magnetic field (the length of the co...

Embodiment 3

[0038] Preparation of the heat-conducting wave-absorbing gasket of embodiment 3:

[0039] 20% of silicone rubber with a viscosity of 500cs, 0.6% of hydrogen-containing silicone oil containing 0.1% of active hydrogen, 0.1% of inhibitors, and 0.07% of 2000ppm platinum catalyst were placed in a stirrer with a rotation speed of 25r / min and stirred for 13min to make Mix the liquid components evenly; then add 23% fibrous carbon fiber with a particle size of 300um, 56.23% spherical carbonyl iron with a particle size of 15um, control the stirrer speed at 60r / min, vacuum -0.09MPa, and continue stirring After 50min, the heat-conducting and wave-absorbing mixture was obtained after the components were mixed uniformly; finally, the heat-conducting and wave-absorbing mixture was transferred to the calender, and the calendering process was carried out through the calender rolls, and the magnetic field orientation was carried out by a curing conveyor furnace with a directional magnetic field ...

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Abstract

The embodiment of the invention discloses a heat-conducting and wave-absorbing gasket and a preparation method thereof. The heat-conducting and wave-absorbing gasket comprises silicone rubber, a heat-conducting filler, a wave-absorbing filler, a cross-linking agent, an inhibitor and a catalyst. According to the heat-conducting and wave-absorbing gasket disclosed by the invention, the heat-conducting filler and the wave-absorbing filler are reasonably proportioned, so that the prepared heat-conducting and wave-absorbing gasket has excellent rebound resilience and compressibility while having excellent heat-conducting and wave-absorbing properties.

Description

technical field [0001] The invention relates to the technical field of heat-conducting wave-absorbing materials, in particular to a heat-conducting wave-absorbing gasket and a preparation method thereof. Background technique [0002] Absorbing materials are widely used in electronic products. With the continuous development of science and technology, the functions of electronic products are becoming more and more powerful, but their volume requirements are getting smaller and their weight is becoming lighter. Except for some main functional application parts, the space left for other auxiliary components is getting smaller and smaller, so it is necessary to integrate other auxiliary functions in the limited space. For example, the material with heat conduction function and the functional material with electromagnetic wave absorption are integrated into a whole to make heat conduction wave absorber material. [0003] With the advent of the 5G era, 5G communication technology...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K7/18C08K7/06C08J5/18C09K5/14
CPCC08J5/18C09K5/14C08J2383/07C08J2483/05C08K7/18C08K7/06
Inventor 黎梓沛王婷冯卓雯
Owner 东莞市博恩复合材料有限公司
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