Surface mounting tool applied to microphone element

A mounting tool and microphone technology, which is applied to the assembly of printed circuits, electrical components, and printed circuits with electrical components, can solve the problems of solder beads and affect the electrical performance of PCB boards, so as to reduce the amount of solder paste and avoid solder beads phenomenon, the effect of ensuring electrical performance

Pending Publication Date: 2022-06-21
南昌龙旗信息技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect that the stencil in the prior art is applied to the PCB board, and the tin ball p

Method used

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  • Surface mounting tool applied to microphone element
  • Surface mounting tool applied to microphone element
  • Surface mounting tool applied to microphone element

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0037] like figure 1 and figure 2 The shown placement tool applied to microphone components includes a placement tool body 1 , an acoustic ring hole 2 and a signal hole 3 . By placing the mounting tool body 1 on the PCB board 6, the solder is laid through the acoustic ring hole 2 and the signal hole 3 on the image 3 On the PCB board 6 shown, the solder is reflowed as in Figure 4 Microphone element 5 shown.

[0038] For example, as Figure 1 to Figure 4As shown, the radius of the third outer edge 511 of the acoustic ring 51 of the microphone element 5 may be 0.725 mm or other values, and the radius of the third inner edge 512 of the acoustic ring 51 of the microphone element 5 may be 0.475 mm or other values; The size of the first intersection edge 521 of the signal pin 52 of the element 5 may be 0.65 mm or other values, and the size of the second intersection edge 522 of the signal pin 52 of the microphone element 5 may be 0.545 mm or other values. The radius of the se...

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PUM

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Abstract

The invention discloses a mounting tool applied to a microphone element. The mounting tool comprises a mounting tool body; the sound ring hole is formed in the mounting tool body and corresponds to a sound ring bonding pad of the PCB, and the area of the sound ring hole is smaller than that of the sound ring bonding pad; the surface mounting tool comprises a surface mounting tool body and a signal hole, the signal hole is formed in the surface mounting tool body and corresponds to a signal bonding pad of the PCB, and the area of the signal hole is smaller than that of the signal bonding pad. According to the mounting tool applied to the microphone element, the area of the sound ring hole is smaller than the area of the sound ring bonding pad, and the area of the signal hole is smaller than the area of the signal bonding pad, so that the amount of solder paste on a PCB can be reduced, the situation that solder collapses and overflows out of the bonding pad due to the acting force of the microphone element is avoided, the solder bead phenomenon is avoided, and the quality of the microphone element is improved. Therefore, the electrical performance of the PCB is ensured.

Description

technical field [0001] The invention relates to the technical field of surface mounting, in particular to a mounting tool applied to a microphone element. Background technique [0002] Surface Mount Technology, or SMT for short, is the most popular technology and process in the electronic assembly industry. In the process of applying SMT, it is necessary to use a mounting tool to solder the components on the pads of the PCB board (printed circuit board) through solder such as solder paste. The mounting tool is also often referred to as a stencil. [0003] The prior art discloses a steel mesh, which includes a steel mesh body, a signal steel mesh hole and a sound ring steel mesh hole. The steel mesh body is provided with a signal steel mesh hole and an acoustic ring steel mesh hole. The signal steel mesh hole corresponds to the The signal pad of the PCB board and the size of the signal steel mesh hole and the signal pad are the same, the acoustic ring steel mesh hole corresp...

Claims

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Application Information

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IPC IPC(8): H05K3/34
CPCH05K3/341
Inventor 刘观平罗宇杜军红葛振纲
Owner 南昌龙旗信息技术有限公司
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