Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bendable semiconductor cooling and heating bands

A semi-conductor and bending technology, which is applied in the direction of refrigerators, refrigeration and liquefaction, lighting and heating equipment, etc., can solve problems such as inability to bend, and achieve the effect of wide application range and obvious heating effect

Inactive Publication Date: 2004-09-15
胡兴起
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the defect that the prior art cannot bend, and provide a bendable semiconductor refrigeration, heating

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bendable semiconductor cooling and heating bands
  • Bendable semiconductor cooling and heating bands
  • Bendable semiconductor cooling and heating bands

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] The present invention is composed of cold zone 1, hot zone 2 and metal bismuth-selenium-antimony alloy particles 3 connected in series in the middle. The cold zone 1 and hot zone 2 are made of bendable and heat-dissipating copper, aluminum, and iron metal sheets coated with copper foil. The insulation between the foil and the metal sheet is as follows: the surface of pure aluminum (copper, iron) is degreasing treatment, then anodized surface chemical treatment is carried out, the epoxy glue is adjusted, and the epoxy glue is applied on the surface of 100 Air-dry treatment at ℃-180℃, laminate FR-4 glass fiber tape for insulation, and then apply electrolytic copper foil on the glass fiber (single layer) tape. The copper foil 4 has a rectangular shape and is evenly distributed in the horizontal and vertical directions along the cold and tropical zones 1 and 2. The optimal length of the copper foil 4 is 10mm-30mm, and the interval is 0.5mm-1mm. The metal bismuth-selenium-antimo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
lengthaaaaaaaaaa
Login to View More

Abstract

The invented is composed of the cold belt, hot belt and the cascaded granules of bismuth, selenium, stibium alloy in middle. The cold belt and hot belt are made of the flexible and radiating sheet metal of copper, aluminium and iron with the copper foil being appleid. The copper foil is insulated with the said sheet metal. The copper foils in rectangle shape are distributed evenly along the landscape orientation and the portrait orientation of the cold belt and hot belt. In the on position, the belt can be bent in the entire wide range without damage. The effect for producing cool or heat is obvious. The difference in temperature reaches to more than 30 deg.C. The product can be utilized to prepare the cold or worm caps or the cold or worm fans.

Description

Technical field [0001] The invention relates to a semiconductor refrigeration and heating assembly, in particular to a bendable semiconductor refrigeration and heating element. Background technique [0002] Semiconductor refrigeration (heating) technology is composed of metal materials composed of bismuth-antimony-selenium alloy chemical elements. The current refrigeration and heating components are composed of solid flat plates and series-connected semiconductor particles, which cannot be bent and deformed, and the driving current is too large, which limits their application in many high-tech fields. Summary of the invention [0003] The purpose of the present invention is to overcome the defect that the prior art cannot be bent, and provide a bendable semiconductor refrigeration and tropical zone. [0004] The present invention is realized by the following schemes: it is composed of metal bismuth-selenium-antimony alloy particles connected in series with a cold zone, a hot zon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): F25B21/02
Inventor 胡兴起
Owner 胡兴起
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com