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Flip-chip mounted integrated circuit card element

An integrated circuit and flip-chip technology, applied in the field of card components, can solve problems such as reducing the bending strength of integrated circuits

Inactive Publication Date: 2003-04-30
SCHLUMBERGER IND INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Various handling and various control operations of the integrated circuit during the manufacturing process and positioning on the card can produce initial fractures on the passive side of the integrated circuit opposite the active side, these fractures reduce the bending strength of the integrated circuit

Method used

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  • Flip-chip mounted integrated circuit card element
  • Flip-chip mounted integrated circuit card element
  • Flip-chip mounted integrated circuit card element

Examples

Experimental program
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Effect test

Embodiment Construction

[0012] refer to figure 1 , the card element with integrated circuit according to the invention comprises a support sheet 1 made in a known manner, for example a sheet of thermoplastic material on which an electric circuit 2 has been made, in this case only two turns are shown in the figure antenna circuit. The circuit 2 comprises terminals 3 which are connected to the contacts 4 of the integrated circuit 5 which are bonded to the support sheet 1 by means of a sealing resin applied between the active side 7 of the integrated circuit and the part opposite the support sheet 1 .

[0013] According to the invention, a booster pad 8 is attached to the passive side 9 of the integrated circuit. The reinforcement disk 8 may be made of any suitable material that provides a reinforcement suitable for the type of integrated circuit and application of the component. In particular, the reinforcing disc can be made of composite material, plastic material or metal, by way of example. Its ...

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Abstract

The invention relates to an integrated circuit card element, comprising a support (1) on which an electrical circuit (2) is produced, an integrated circuit (5) being connected thereto and having an active flip-chip mounted surface (7), said integrated circuit (5) being fixed to the support by a sealing product (6) that is arranged between the active surface of the integrated circuit and the support. The inventive element comprises a reinforcement segment (8) which is fixed on an inactive surface of the integrated circuit opposite the active surface (7).

Description

technical field [0001] The present invention relates to a card element having an integrated circuit secured by flip-chip technology. Background technique [0002] As the development of applications employing integrated circuits is increasing, there is a need for more production of card elements including integrated circuits. To meet this need, there is a need for a method of quickly attaching an integrated circuit to the card element. For this purpose, flip-chip technology is used, in which the active side of the integrated circuit with its connecting terminals is attached directly to the terminals of a pre-produced electronic circuit. In addition, the integrated circuit is bonded to the support sheet by a sealing resin applied between the active side of the integrated circuit and the support sheet. [0003] In conventional manufacturing techniques, when some card elements, especially the card elements, are to be formed as part of a card used in an ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077H01L21/56
CPCG06K19/07745G06K19/07728G06K19/077G06K19/0775H01L2224/16
Inventor 索菲·吉拉德斯蒂芬·普罗沃斯特
Owner SCHLUMBERGER IND INC
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