Laminating method and laminating device

A technology for bonding devices and bonding surfaces, applied in lamination devices, chemical instruments and methods, lamination auxiliary operations, etc., can solve problems such as difficulties in bonding foils, and achieve reliable bonding effects
CN1830076AInactive Publication Date: 2006-09-06TOKYO ELECTRON LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TOKYO ELECTRON LTD
Publication Date
2006-09-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

A pasting method and a pasting apparatus hold a thin plate 1 and a planar member 2 in high flatness respectively on a first holding member 44 and a second holding member 44, a main controller 40a controls a moving mechanism 45 and a parallelism adjusting mechanism 52 on the basis of information provided by position recognizing mechanisms 33 and 34 to align the thin plate 1 and the carrying member 2 with each other in a predetermined positional relation. The main controller 40a controls a moving mechanism 45 so as to move the thin plate 1 and the carrying member 2 relative to each other in a state where a liquid-phase liquid crystal wax heated by a heater 49 is held between the thin plate 1 and the carrying member 2 to spread the liquid-phase liquid crystal wax over the entire surfaces of the thin plate 1 and the carrying member 2. Thus the thin plate 1, such as a semiconductor wafer or a metal foil, can be accurately, surely and efficiently pasted to the carrying member 2, and the thin plate 1 pasted to the carrying member 2 can be readily separated from the carrying member 2.
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Description

technical field

[0001] The present invention relates to a bonding method and a bonding device for bonding thin plate-like objects such as semiconductor wafers or metal foils to other objects. Background technique

[0002] In the manufacture of semiconductor equipment, with the increase in size and thickness of semiconductor wafers (hereinafter referred to as wafers), warpage or cracks during wafer handling cannot be ignored. For example, if warping occurs during wafer transfer, CMP polishing, dry etching, or ion implantation, while the wafer is being attracted to an electrostatic chuck, etc., high-precision processing cannot be performed. In addition, there is a problem that cracks easily occur.

[0003] For this reason, it has been proposed to bond a wafer to a support substrate with an adhesive such as wax and perform a process such as polishing. For example, in the Japanese Patent Laid-Open Publication No. 8-139165, the technology of bonding them with a stamper is discl...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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