Cooling apparatus for computer parts
A cooling device, computer technology, applied in computing, digital data processing parts, semiconductor/solid-state device parts, etc., can solve the problem of air flow not pointing towards the ventilation opening of the casing, etc.
Inactive Publication Date: 2006-12-06
ZALMAN TECH CO LTD
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Problems solved by technology
[0011] However, most conventional cooling devices with the above-mentioned extruded and fixed units according to the prior art must be fixed in a certain direction relative to the components mounted on the base board inside the computer, so that the air flow may not be directed towards the ventilation openings of the housing.
Furthermore, separate pressing and fixing units are required in the prior art depending on the type of cooling unit used
Method used
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[0028] figure 1 is a perspective view of a cooling device for computer components according to an embodiment of the present invention, figure 2 yes figure 1 Perspective view of the heat transfer block and heat pipes of the cooling device, image 3 yes figure 1 Side view of the cooling unit.
[0029] A cooling device for computer components according to an embodiment of the present invention is a device for cooling a heat generating portion mounted on a substrate in a computer.
[0030] refer to figure 1 , the cooling device 1 includes a heat transfer block 10 , a heat dissipation unit and an extruding and fixing unit 40 .
[0031] The heat transfer block 10 receives heat generated by a heat generating part (not shown) mounted on a substrate inside a computer, such as a central processing unit (CPU), and the heat transfer block 10 is fixedly attached to an upper surface of the heat generating part. . The heat transfer block 10 is formed of a material having high thermal...
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Provided is an apparatus for cooling heat generating parts mounted on a substrate in a computer. The cooling apparatus includes: a heat transfer blockto be attached onto the heat generating part to receive heat generated by the heat generating part; a heat dissipation unit receiving the heat from the heat transfer block and dissipating the heat outside; and a pressing and fixing unit attaching the heat transfer block onto an upper surface of the heat generating part. The pressing and fixing unit includes: a boss unit protruding upward from an upper surface of the heat transfer block; and an elastic member including a pressing unit having a receiving portion for receiving the boss unit and pressing the upper surface of the heat transfer block, a pair of elastic deformation portions extending from opposite sides of the pressing unit, and fixing units formed on end portions of the elastic deformation portions and fixed to the substrate.
Description
[0001] This application claims priority from Korean Patent Application No. 10-2005-0045737 filed with the Korean Intellectual Property Office on May 30, 2005, the disclosure of which is incorporated herein by reference in its entirety. technical field [0002] The present invention relates to a cooling device for computer components, in particular, to such a cooling device comprising an extruding unit which can connect a heat transfer block on the upper surface of a heat generating part to cool the heat generated in a computer part, regardless of the arrangement of surrounding components. Background technique [0003] A computer includes heat generating components such as a central processing unit (CPU) or a chipset mounted on a substrate of a graphics adapter. Such heat generating parts generate a large amount of heat when the computer is in operation, and unless the heat is effectively removed, these heat generating parts may overheat, which will cause the components to be...
Claims
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IPC IPC(8): G06F1/20
CPCH01L2924/0002H01L23/427H01L23/467G06F1/20
Inventor 李祥哲尹璇奎郑相俊李相奎
Owner ZALMAN TECH CO LTD