Production method for pattern-worked porous molding or nonwoven fabric, and electric circuit components

一种无纺织物、制造方法的技术，应用在电气元件、多孔电介质、印刷电路零部件等方向，能够解决难形成深穿透孔和沟槽等问题，达到低成本的效果
CN1910013AInactive Publication Date: 2007-02-07SUMITOMO ELECTRIC IND LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SUMITOMO ELECTRIC IND LTD
Publication Date
2007-02-07
Estimated Expiration
Not applicable · inactive patent

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Abstract

An object of the present invention is to provide a method for manufacturing a porous material in which complicated and fine through portions, recessed portions, and the like have been patterned. It is to provide a patterned porous molded product or nonwoven fabric, in which a plated layer has been selectively formed on the surfaces of the through portions and the recessed portions. With the invention, a mask having through portions in a pattern is placed on at least one side of the porous molded product or the nonwoven fabric. A fluid or a fluid containing abrasive grains is sprayed from above the mask, thereby to form through portions or recessed portions, or both of them, to which the opening shape of each through portion of the mask has been transferred, in the porous molded product orthe nonwoven fabric. The invention provides a porous molded product or a nonwoven fabric in which a plated layer has been selectively formed on the surfaces of the through portions or the recessed portions, or both of these, an electric circuit component, or the like.
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Description

technical field

[0001] The present invention relates to a method of manufacturing a porous molded product or nonwoven fabric in which penetrating portions such as penetrating holes and penetrating grooves and recessed portions such as grooves have been patterned. Also, the present invention relates to a manufacturing method of a porous molded product or a nonwoven fabric, wherein a plating layer is selectively formed on the surface of a recessed portion, a penetrating portion, or both by patterning. Furthermore, the invention also relates to circuit elements made of porous molded products or nonwovens with a patterned coating. According to the present invention, the porous molded product or the nonwoven fabric having the patterned plating layer can be preferably applied to technical fields such as semiconductor device mounting members, electrical reliability inspection members, and the like. Background technique

[0002] Substrates for fabricating electronic components may ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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