Vertical probe card

A probe card, vertical technology, used in the field of probe cards, can solve the problems of affecting the conductivity of the probe, increasing the resistance value, overheating, and low reliability of the probe card.

Active Publication Date: 2007-02-14
VISERA TECH CO LTD
View PDF0 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the two ends of each probe (63) of the above-mentioned probe card (60) are electrically connected to the chip and the circuit board (61) respectively, they are instantly connected between the top of the probe (63) and each pad (64). The high current often causes the temperature between the two to be overheated, and even sparks are emitted, so that the top of the probe (63) produces an oxide layer and carbonization, which affects the conductivity of each probe (63) and increases the resistance value; and , after the probe card is used for a long time, the components of the probe card (60) are more prone to breakage, the reliability of the probe card is low, and the service life is also short

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vertical probe card
  • Vertical probe card
  • Vertical probe card

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] A preferred embodiment is given below in conjunction with the accompanying drawings, in order to further illustrate the structure and effect of the present invention:

[0023] see figure 1 and figure 2 As shown, the vertical probe card provided by a preferred embodiment of the present invention, the probe card (10) includes a circuit board (20), a guide mechanism (30), and a plurality of probes (40); The circuit board (20) has a top surface (21), a bottom surface (22), and a positioning portion (23) recessed from the bottom surface (22) toward the top surface (21), and a fixing portion (23) is provided in the positioning portion (23). part (24), the surface of the fixing part (24) is provided with a plurality of conductive grooves (25), and each of the conductive grooves (25) is recessed in the fixing part (24), thereby forming an end face (26) and a ring wall (27 ); the end face (26) and the ring wall (27) of each conductive groove (25) all have a conductive film, ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

A vertical probe card is prepared as setting multiple concave conductive groove on surface of circuit board as each said groove being set with a ring wall, setting multiple through hole on guide mechanism being set at circuit board surface with conductive groove, setting the first end of probe in said conductive groove to make probe be connected against with ring wall and be electrically connected to circuit board and passing the second end of probe through said through hole set on guide mechanism.

Description

technical field [0001] The present invention relates to a probe card, in particular to a vertical probe card. Background technique [0002] At present, when testing a flip chip (Flip chip) or a chip with high-density contacts, the vertical probe card (Vertical Probe Card) is mainly used to test the chip; The probes are electrically connected vertically to the contacts of the chip to be tested and the test machine, so that each probe is used to transmit test signals between the test machine and the wafer. [0003] The structure of the general vertical probe card, such as Figure 4 As shown, the vertical probe card (60) includes a circuit board (61), a guide mechanism (62), and a plurality of probes (63); the bottom surface of the circuit board (61) has some raised welding pads (64), the guide mechanism (62) is located at the position of the bottom surface of the corresponding circuit board (61), each probe (63) is arranged in the guide mechanism (62) in a movable manner, eac...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/073G01R31/28G01R31/00
Inventor 卢笙丰
Owner VISERA TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap