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Mirror holding mechanism in exposure apparatus, and device manufacturing method

a technology of mirror holding mechanism and exposure apparatus, which is applied in the direction of photomechanical apparatus, instruments, optical elements, etc., can solve the problems of short circuit in the circuit pattern formed on the wafer, easy deformation due to self-weight, and large lens volum

Inactive Publication Date: 2006-04-06
KINO YOSHIKI +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Such aberration produces a positional deviation that may result in short-circuit in a circuit pattern formed on a wafer.
The lens volume is thus large and, as a result, deformation due to self weight easily occurs.
However, the base material constituting the mirror is very soft, and only a force (holding force) applied by a holding member for holding the mirror will be sufficient to produce deformation of a few nanometers in the mirror.
Also, thermal expansion, vibration or deformation of the holding member may cause a positional deviation of the mirror.
For theses reasons, it is very difficult to hold a mirror within a projection optical system without a change in mirror shape or in mirror position with respect to the optical axis, to ensure desired optical performance.

Method used

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  • Mirror holding mechanism in exposure apparatus, and device manufacturing method
  • Mirror holding mechanism in exposure apparatus, and device manufacturing method
  • Mirror holding mechanism in exposure apparatus, and device manufacturing method

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Embodiment Construction

[0051] Preferred embodiments of mirror holding method and exposure apparatus according to the present invention will now be described with reference to the attached drawings. However, the invention is not limited to these embodiments, and components may be replaced alternately within the scope of the invention. For example, in the embodiments to be described below, the invention is applied to a projection optical system 530 of an exposure apparatus 500, the invention may be applied to an illumination optical system 514 of the exposure apparatus 500 or to any other optical system well-known in the art. In the drawings, the same reference numerals are assigned to corresponding elements, and duplicate description therefor will be omitted. FIG. 1 is a schematic and side view of a mirror holding method 100 according to an aspect of the present invention.

[0052] Denoted at 110 is a mirror for imaging light on the basis of reflection. The mirror 110 has a reflection surface on which a mult...

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Abstract

Disclosed is a mirror holding system by which aberration resulting from deformation or positional deviation of an optical member, causing degradation of imaging performance, can be reduced whereby a desired optical performance is assured. Also disclosed is an exposure apparatus and a device manufacturing method based on such mirror holding system. The holding system includes a supporting member for supporting the optical element at a plurality of supports which are movable along an approximately radial direction about a predetermined point.

Description

[0001] This application is a continuation application of co-pending U.S. application Ser. No. 10 / 778,810, filed Feb. 13, 2004, and entitled “Mirror Holding Mechanism In Exposure Apparatus, And Device Manufacturing Method”. Aforementioned U.S. application Ser. No. 10 / 778,810, filed Feb. 13, 2004, is incorporated by reference herein in its entirety. [0002] This application claims the right of priority under 35 U.S.C. § 119 to Japanese Application Number 2003-035271 filed Feb. 13, 2003, in Japan.FIELD OF THE INVENTION AND RELATED ART [0003] This invention relates generally to a precision instrument on which an optical member is mounted and, more particularly, to a projection optical system for use in an exposure apparatus, for example. Specifically, the invention concerns a holding system for an optical member, usable in an exposure apparatus for lithographic procedure for manufacture of semiconductor devices, image pickup devices such as CCD, or thin-film magnetic heads, for example, ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): G02B7/02G02B7/00G02B7/182G02B7/198G03F7/20H01L21/027
CPCG02B7/182G03F7/70825G03F7/7095
Inventor KINO, YOSHIKIMIWA, YOSHINORIHONDA, MASANORI
Owner KINO YOSHIKI