Plating solution and metal composite and method of manufacturing the same

a technology of metal composite and plating solution, which is applied in the direction of carbon-silicon compound conductors, coatings, and fulllerenes, etc., can solve the problems of high ampacity development of wire materials, and achieve the effect of improving current capacity, conductivity and electrical stability

Pending Publication Date: 2021-07-22
SAMSUNG ELECTRONICS CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The metal composite material exhibits enhanced ampacity, improved conductivity, and electrical stability, with the ability to form fine patterns and wires with increased current-transport capability, effectively addressing the limitations of existing technologies.

Problems solved by technology

However, as ampacity, i.e., ampere capacity, of a metal line reaches a limit according to development of information technology (IT), development of a wire material having high ampacity is required.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Plating solution and metal composite and method of manufacturing the same
  • Plating solution and metal composite and method of manufacturing the same
  • Plating solution and metal composite and method of manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

synthesis example

[0093]10 grams (g) of a hydroxyl fullerene precursor (C60(OH)6-12, Nanom Spectra D100, Frontier Carbon Corp.) is dispersed in a 30% hydrogen peroxide solution and then, stirred at 60° C. for 48 hours in a flask to synthesize a hydroxyl fullerene represented by Chemical Formula 1 (C60(OH)24-36, Peak: C60(OH)31. In C60(OH)n (Peak), n denotes the number of OH at a maximum peak on a mass spectrum (LCMS) of FIGS. 7 and 8 and is marked as an integral by rounding off to the nearest whole number.

[0094]When measured in a dynamic light scattering method (SUPTEK Yag Keceleri San. ve Tic. A.S.), the hydroxyl fullerenes have an average particle diameter of about 1 nanometer (nm).

Preparation of Plating Solution

example

[0103]Each of Ru / Ta is subsequently coated with a thickness of 10 nm on a silicon wafer, the silicon wafer (a cathode) and an opposed electrode (a positive electrode) are disposed to face each other in the plating solution according to Preparation Example 3, and then, the plating solution is stirred at 20° C. While the plating solution is stirred, the positive electrode and the cathode are connected to power and then, plated by flowing a current with various average current densities (0.1 amperes per square decimeter (A / dm2) to about 1.0 A / dm2) for 45 minutes. The obtained Cu plating layer (including a metal composite material) has a thickness of 1 micrometer (μm).

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
room temperatureaaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to View More

Abstract

A plating solution including a metal salt, a hydrophilic fullerene, and water, a metal composite material including a hydrophilic fullerene and a method of manufacturing the same, and a wire, a flexible printed circuit (FPC), and an electronic device including the metal composite material.

Description

CROSS-REFERENCE TO RELATED APPLICATION[0001]This application is a divisional application of application Ser. No. 16 / 176,332, filed Oct. 31, 2018, which claims priority to and the benefit of Korean Patent Application No. 10-2018-0009925 filed in the Korean Intellectual Property Office on Jan. 26, 2018, and all the benefits accruing therefrom under 35 U.S.C. § 119, the entire contents of which are incorporated herein by reference.BACKGROUND1. Field[0002]A plating solution, a metal composite material, and a method of manufacturing the same are disclosed.2. Description of the Related Art[0003]Recently, research on a material and a method of forming a fine metal line has been made in accordance with reductions in sizes of electronic devices and thereby, miniaturizing an integrated circuit. A method of forming the fine metal line may for example include a method of filling a metal in a groove such as a via and a trench through an electrodeposition such as electroplating a metal.[0004]Howe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & AuthorityApplications(United States)
IPC IPC(8): C25D3/38C25D7/06H01B1/04H05K3/18H05K1/09C25D15/00C25D15/02
CPCC25D3/38C25D7/0607H01B1/04H05K3/188H05K1/028C25D15/00C25D15/02H05K2201/0323H05K1/092H05K3/045H05K2203/0723H05K2201/09036C25D7/123C25D3/02H05K1/09B82Y30/00B82Y40/00C01B32/156
InventorTAKAI, KENJILEE, SANG EUIMINAMI, DAIKI
OwnerSAMSUNG ELECTRONICS CO LTD