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Printed wiring board reliably achieving electric connection with electronic component

a technology of printed wiring board and electronic components, applied in the direction of printed circuit structure association, electrical apparatus construction details, magnetic/electric field screening, etc., can solve the problem of reducing the flexure of printed wiring board, and achieve the effect of preventing poor connection

Inactive Publication Date: 2012-07-31
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0007]It is accordingly an object of the present invention to provide a printed wiring board capable of reliably preventing poor connection between terminals of an electronic component and terminal pads.

Problems solved by technology

This results in suppression of flexure of the printed wiring board during reflow.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045]FIG. 1 illustrates the structure of an MP3 (MPEG-1 Audio Layer-3) player as an electronic apparatus according to a first embodiment of the present invention. The MP3 player 11 includes an enclosure 12. A printed circuit board unit is placed within the enclosure 12. The printed circuit board unit will be described later. A display panel 13 and an operating piece 14 are embedded in the enclosure 12. The display panel 13 serves to display the track number and other information of stored songs or the like, for example. A user manipulates the operating piece 14 to store a song or the like in the MP3 player 11. A user also manipulates the operating piece 14 to choose a song or the like to be played.

[0046]As shown in FIG. 2, a printed circuit board unit 16 includes a printed wiring board 17. Electronic components or semiconductor chip packages 18a, 18b are mounted on the front surface of the printed wiring board 17. The individual semiconductor chip package 18a includes terminals 19....

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PUM

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Abstract

Terminal pads are arranged on a first surface of the substrate for an electronic component to receive terminals of the electronic component. An electrically-conductive film is formed on a second surface defined on the back of the first surface over the back of a mounting area for the electronic component. The mounting area is contoured along the outer periphery of the arrangement of the terminal pads. The ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the back of the mounting area is set appropriate to the ratio of the area of the electrically-conductive material to the area of the surface of the substrate over the mounting area for each electronic component. This results in suppression of flexure of the printed wiring board during reflow.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a printed wiring board. In particular, the present invention relates to a printed wiring board utilized in a printed circuit board unit incorporated in a portable electronic apparatus, for example.[0003]2. Description of the Prior Art[0004]An electronic component is mounted on a printed wiring board. Terminal pads made of an electrically-conductive material are formed on the front and back surfaces of the substrate. The terminals of the electronic component are received on the terminal pads, respectively. The terminals of the electronic component are soldered to the terminal pads, for example.[0005]Reflow is employed to solder the electronic component. Solder cream is printed on the printed wiring board. The terminals of the electronic component are set on the solder cream. The printed wiring board and the electronic component are then put into a reflow oven. Heat is applied to the solde...

Claims

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Application Information

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Patent Type & Authority Patents(United States)
IPC IPC(8): H05K7/10H05K7/12
Inventor NAKAMURA, NAOKISUGINO, SHIGERUKANAI, RYO
Owner FUJITSU LTD