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3results about How to "No nudity" patented technology

Outdoor lighting lamp for high-end ro-ro passenger ship

The utility model relates to the technical field of ship electric appliances, in particular to a high-end ro-ro passenger ship outdoor lighting lamp which is provided with a bulkhead, cable penetrating holes are formed in the bulkhead at intervals, a supporting pipe is arranged on the outer side of the bulkhead at the positions of the cable penetrating holes, one end of the supporting pipe wraps the cable penetrating holes and is fixedly connected with the bulkhead, and the other end of the supporting pipe is connected with a lampshade. A lamp tube is inserted into the lampshade, a cable jack communicated with an inner cavity of the supporting tube is formed in the lampshade, a wiring terminal is arranged on the lamp tube and connected with a cable, and the cable penetrates through the cable jack, then sequentially passes through the supporting tube and the cable penetrating hole and then is connected with a power supply on the inner side of the cabin wall. The cable has the advantages of simple structure, high communication efficiency in a design stage, no cable exposure, no fire, good aesthetic property, neat exterior and the like.
Owner:AVIC WEIHAI SHIPYARD

High thermal conductivity diamond / copper composite material and sintering process thereof by spark plasma sintering

PendingCN122382391AUniform and dense coatingNo nudity
The application provides a high-thermal-conductivity diamond / copper composite material and an SPS sintering process thereof, raw material pretreatment: selecting three kinds of monocrystalline diamond particles with different particle sizes, mixing the titanium-plated diamond obtained after vacuum titanium plating treatment; solid dry powder mixing: uniformly mixing a solid additive and graphene modified copper powder to prepare a copper-based composite dry powder; nitrogen intermittent airflow suspension dispersion: adding the titanium-plated diamond into a sealed covering tank to make the titanium-plated diamond suspended and dispersed in the sealed covering tank; atomization covering makes the copper-based composite dry powder uniformly covered on the surface of the titanium-plated diamond to obtain composite particles; vacuum low-temperature degreasing to obtain the composite particles after degreasing, and SPS sintering demolding to obtain the high-thermal-conductivity diamond / copper composite material. The coating is uniform and dense, has no exposure and no agglomeration, and significantly reduces porosity and interface thermal resistance; the proportioning is accurate, the degreasing is thorough, and there is no residue; the generation of brittle phases is inhibited, and the interface combination is excellent; the thermal conductivity is stable and greater than 700 W / (m*K), and the density is greater than or equal to 99%.

An LED chip structure for improving device performance

ActiveCN224805356UReduce direct contact areaShorten the migration path
The utility model relates to a kind of LED chip structure for improving device performance, recess that is through second semiconductor layer and active layer, and extend to the inside of first semiconductor layer;With the ohmic contact of second semiconductor layer, the first conductive layer is covered in the part surface of second semiconductor layer and forms regular recess on the surface of first conductive layer first insulating layer;Covered in the part surface of first insulating layer and filled in the recess formed by first insulating layer, and the first reflective layer is electrically connected with first conductive layer;Covered in the part surface of first insulating layer and forms electrically connected with first reflective layer second conductive layer, covered in the sidewall of recess and the second insulating layer of first electric connection layer side, covered in the part surface of second insulating layer and filled in recess second reflective layer, second reflective layer forms ohmic contact with first semiconductor layer.The utility model improves external quantum efficiency, i.e. Lower forward voltage, improve chip brightness;Reduce thermal effect, prevent metal migration to cause failure.
Owner:GEN SEMICONDUCTOR (ANHUI) CO LTD