Substrate conveying device and method

Abstract

The present invention provided a substrate conveyance device capable of efficiently transferring a substrate to a processing chamber when processing the substrate in the processing chamber by inclining the substrate. This substrate conveyance device is provided with a carrying-in transfer part 3 for inclining the substrate fed in a horizontal condition at a predetermined inclination angle to transfer it to the processing chamber 6, an inclination conveyance part 4 for receiving the substrate inclined at the predetermined angle in the carrying-in transfer part to convey it in a processing part at the inclination angle, and a carrying-out transfer part 5 for receiving the substrate conveyed in the processing part chamber at the predetermined inclination angle and processed from the inclination conveyance part and returning it into a horizontal condition. At least either of the carrying-in transfer part and the carrying-out transfer part is constituted by first and second carrying-in or carrying-out conveyors 31 to 34 which are sequentially arranged along the direction of conveyance of the substrate and can set inclination angle of the substrate separately and whose length is set to be shorter than length along the direction of conveyance of the substrate.

Description

technical field [0001] The present invention relates to a conveying device and a conveying method for conveying a substrate processed by a processing liquid in a processing unit. Background technique [0002] A circuit pattern is formed on a glass substrate used in a liquid crystal display device. Photolithography is used to form circuit patterns on the substrate. Photolithography is a well-known technique in which a resist is coated on the above-mentioned substrate, and light is irradiated onto the resist through a mask on which a circuit pattern is formed. [0003] Next, remove the part of the resist that is not irradiated with light or the part that is irradiated with light, etch the part of the substrate where the resist is removed, and repeat a series of steps such as removing the resist after etching, A circuit pattern is formed on the above substrate. [0004] In such a photolithography technique, there is a process of treating the substrate with a chemical solutio...

AI Technical Summary

Problems solved by technology

[0011] However, on the loading side and the unloading side, if a conveyor tilts the substrate at a set angle and then transfers it to the processing section, or receives a substrate processed in the processing section and restores it to a horizontal position, at least the substrate on the loading side More than one-half of the length dimension is transferred to the conveyor in the processing section, and the loading conveyor on the loading side cannot be turned back to the horizontal level to receive the next substrate

Therefore, there is a problem that the production interval time required until the carrying-in conveyor can accept the next substrate, that is, the production interval time required for handover becomes longer.

[0012] In addition, on the unloading side, after the unloading conveyor receives the substrate from the conveying conveyor in the processing section and lays it horizontally, until the entire substrate is unloaded from the unloading conveyor, the unloading conveyor cannot be tilted to a predetermined inclination angle. Since the next substrate is received, there is also a problem that the production interval time required for substrate transfer becomes longer as on the loading side.

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