Lithographic apparatus and device manufacturing method
A component and encoder technology, applied in microlithography exposure equipment, semiconductor/solid-state device manufacturing, optomechanical equipment, etc., can solve problems such as deformation, measurement error, long control stabilization time, and non-monolithic objects
Inactive Publication Date: 2007-12-12
ASML NETHERLANDS BV
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Problems solved by technology
[0010] A further possible disadvantage of the known bonding methods is that the bonding may introduce additional flexibility between the two object parts, leading to non-monolithicity of the object
This non-monolithicity can lead to internal deformations leading to measurement errors and long control settling times during object positioning
Method used
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[0021] Fig. 1 schematically depicts a lithographic apparatus according to an embodiment of the present invention. The apparatus comprises an illumination system (illuminator) IL configured to condition a radiation beam B (e.g. UV radiation or any other suitable radiation) and a mask support structure (e.g. a mask table) MT, the mask The support structure MT is used to support the patterning device (eg mask) MA and is connected to a first positioning device PM configured to accurately position the patterning device according to certain parameters. The apparatus also includes a substrate table (e.g., wafer table) WT or "substrate support" for supporting a substrate (e.g., a photoresist-coated wafer) W and configured to accurately position the substrate according to certain parameters. The second positioning device PW is connected. The apparatus also comprises a projection system (eg a refractive projection lens system) PL for projecting a pattern imparted to the radiation beam ...
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Abstract
The present invention relates to a method of assembling an object that includes providing a first object part having a first surface, providing a second object part having a second surface, positioning the first and the second object parts such that the first and the second surfaces face each other, wherein a gap is defined between the first and the second surfaces, applying a glue to at least a part of the gap, holding the first object part and the second object part at a distance during a period of time, wherein the gap is substantially filled with the glue due to capillary action and / or gravity, and moving the first and the second object parts toward each other to reduce the distance between the first and the second surfaces.
Description
technical field [0001] The invention relates to a lithographic apparatus comprising an object consisting of two or more object parts, a first object part and a second object part of which are bonded together, and to a A method in which an object part and a second object part are bonded to each other to form an article. Background technique [0002] A lithographic apparatus is a machine that applies a desired pattern to a substrate (usually to a target portion of the substrate). A lithographic apparatus may be used, for example, in the manufacture of integrated circuits (ICs). In that case, a patterning device, otherwise known as a mask or reticle, may be utilized to generate the circuit pattern to be formed on the individual layers of the IC. The pattern can be transferred onto a target portion (eg comprising a portion of a die, one or several dies) on a substrate (eg a silicon wafer). The transfer of the pattern is usually by means of imaging on a layer of radiation-sens...
Claims
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IPC IPC(8): G03F7/20H01L21/027
CPCC09J5/00G03F7/70716G03F7/70975G03F7/70775Y10T428/265G03F7/707
Inventor S·B·C·M·马滕斯R·H·G·克拉默
Owner ASML NETHERLANDS BV