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Baffle structure

A baffle structure and baffle technology, used in instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of leakage and dissipation of heat dissipation airflow and inability to prevent hollow structures.

Inactive Publication Date: 2011-06-29
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the above-mentioned shortcomings of the prior art, the present invention provides a baffle structure that can solve the problem that the existing partition structure cannot prevent the leakage of heat dissipation airflow caused by the hollow structure, and can realize the purpose of wire clamping and positioning

Method used

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Examples

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Embodiment Construction

[0029] Please also refer to figure 2 , which is a schematic diagram of the application of the baffle structure of the present invention. As shown in the figure, the baffle structure 2 of the present invention includes a baffle structure, including: a body 21, an engaging portion 22 and a wire hole 23. In this embodiment, the body 21, the engaging portion 22 and the The wire hole 23 is made of elastic materials such as rubber.

[0030] In addition, in this embodiment, the baffle structure 2 of the present invention is used to be clamped to the partition 3 , and the partition 3 is disposed on the base 4 of the casing of the electronic device. The separator 3 has a first lead portion 31 , a second lead portion 32 , a rib 33 disposed between the first lead portion 31 and the second lead portion 32 , and a fixing post 34 . The components of the baffle structure 2 of the present invention will be specifically described below.

[0031] The body 21 has a first surface 21a and a se...

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PUM

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Abstract

The invention provides a baffle structure which is used for connecting with a diaphragm. The invention comprises a body, a block part and a wire hole. The body is provided with a bracket hole and a first wire blocking part is arranged on at least one side. The bracket hole is corresponding to and covered on the fixed pillar of the diaphragm. The body is also provided with a first bulgy part. The blocking part is arranged on the side of the body which is adjoined with the first bulgy part. The blocking part is provided with a first buckling part and a second buckling part which is relative to the first buckling part. The first buckling part is arranged on the side which is adjoined with the first bulgy part. The first buckling part and the second buckling part are buckled on the diaphragm.The wire hole is arranged on the square staff of the body and is adjoined with the second buckling part of the blocking part. The wire is embedded in the second wire part and is provided with a second wire blocking part and an opening which communicates the second wire blocking part with the exterior. The baffle structure of the invention solves the problem of leakage and dissipation of heat dissipation flow through the block part blocked and buckled on the diaphragm and through the first bulgy part and the wire hole filling the hollow structure outside the baffle setting line.

Description

technical field [0001] The present invention relates to a baffle structure, in particular to a baffle structure capable of solving the problem of leakage and escape of heat dissipation airflow. Background technique [0002] Usually, in electronic equipment such as computers or servers, the internal space of the electronic equipment is separated by a plurality of partitions according to the setting of different functional mechanisms. The lines run through different separated spaces, so at least one lead portion is provided in each. [0003] see figure 1 , which is a schematic structural diagram of an existing separator. As shown in the figure, the spacer 1 is provided with a first wire part 11 and a second wire part 12, and the first wire part 11 and the second wire part 12 can be, for example, respectively used to lead signal cables of IDE standard. 13 and a power supply harness 15 composed of a plurality of power lines of the power supply device 14. However, due to cons...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F1/20
Inventor 李志平郑再魁
Owner INVENTEC CORP
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